Principal Optical Packaging Engineer – Fiber-to-Chip Leader

nEye.ai; Santa Clara (CA); On-site; USD 150,000 - 210,000; Full time

Job summary

nEye.ai in Santa Clara, CA, seeks a Principal Packaging Design Engineer to lead next-generation silicon photonics packaging. You will own the optical interfacing process, from design of optical/mechanical structures to implementation with contract manufacturers.

You will work with IC, mechanical, and reliability teams to push fiber-to-chip coupling, thermal stability, and long-term reliability, requiring hands-on expertise in precision optical assembly and edge coupling.

Qualifications

• Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Materials Science, Optical Engineering, or a related field.
• 10+ years of hands-on experience in packaging design for optical or photonic components.
• Direct experience with PIC optical edge coupling and associated challenges, including proficiency with active and passive alignment techniques.
• Direct product development and introduction experience involving edge coupling.
• In-depth knowledge of packaging materials, including optical adhesives and epoxies, and their design constraints, and how to use them in a high reliability application.
• Proven ability to work with contract manufacturers to design, implement, and ramp packaging processes to volume production.
• A strong understanding of reliability engineering principles, including failure mechanisms related to packaging, and experience with relevant testing standards (e.g., Telcordia).
• Experience with CAD tools for mechanical design and packaging layouts.

Responsibilities

• Design and develop robust, high-yield processes for active and passive optical interfaces to photonic integrated circuits (PICs).
• Specialize in using advanced methods to achieve stable and reliable fiber coupling. This includes selecting appropriate materials and controlling critical parameters.
• Collaborate with IC and mechanical design teams to define and create structures that minimize stress, ensure thermal stability, and enhance the overall reliability of the package.
• Act as the key technical interface with our contract manufacturing partners, coordinating process design, implementation, and characterization to ensure a smooth transition from development to high-volume production.
• Define and manage critical process controls, alignment tolerances, and metrology methods to ensure consistent, high-performance output in a manufacturing environment.
• Conduct in-depth analysis of assembly and packaging yield data to drive continuous process improvement.
• Define and implement test methodologies to characterize the reliability of packaged devices under various environmental and mechanical stresses.
• Analyze reliability data to identify potential failure modes and work with design teams to implement corrective actions.

Skills

Edge coupling

Optical packaging

Reliability engineering

Contract manufacturer liaison

Thermal/structural analysis

CAD tooling

Education

Bachelor's, Master's, or Ph.D. in Mechanical Engineering

Materials Science

Optical Engineering

Tools

3D CAD

FEA software

Manufacturing fixtures design

Job description

nEye.ai in Santa Clara, CA, seeks a Principal Packaging Design Engineer to lead next-generation silicon photonics packaging. You will own the optical interfacing process, from design of optical/mechanical structures to implementation with contract manufacturers.

You will work with IC, mechanical, and reliability teams to push fiber-to-chip coupling, thermal stability, and long-term reliability, requiring hands-on expertise in precision optical assembly and edge coupling.