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Tessolve Semiconductors is hiring IC Packaging Design Engineers for Chandler, AZ (primary) or Hillsboro, OR (secondary). Senior candidates with 10+ years are preferred; mid-level (4–6+ MS / 6+ BS) are also considered.
You’ll design IC packages, drive substrate layout, and ensure reliability, manufacturability, and SI/PI-aware implementations. Join a leading semiconductor engineering firm and work on cutting-edge packaging projects with flexible location options in Chandler, AZ or Hillsboro, OR.
Tessolve Semiconductors is hiring IC Packaging Design Engineers for Chandler, AZ (primary) or Hillsboro, OR (secondary). Senior candidates with 10+ years are preferred; mid-level (4–6+ MS / 6+ BS) are also considered.
You’ll design IC packages, drive substrate layout, and ensure reliability, manufacturability, and SI/PI-aware implementations. Join a leading semiconductor engineering firm and work on cutting-edge packaging projects with flexible location options in Chandler, AZ or Hillsboro, OR.