Senior IC Package Layout Engineer – Hybrid & 3D/2.5D

Arm

Chandler (AZ)

Hybrid

USD 162,000 - 219,000

Full time

3 days ago

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Benefits offered by this job

Hybrid working

Accommodation support during the招聘

Job summary

Arm is seeking a Senior Package Layout Engineer for the System-in-Package team. You will develop IC package layouts for high-speed signals and power devices and help build Arm's next generation of SoCs for IoT, automotive, and compute spaces.

You will collaborate with teams in France, the US, the UK, and other Arm locations, applying Cadence APD/Allegro tools to drive standardization and efficiency in layout methods while supporting hybrid work arrangements.

Qualifications

An Electrical Engineering degree or equivalent work experience.
Experience with 2.5D and 3D package systems and their SI/PI requirements.
3-5 years of recent experience in the use of Cadence APD & Allegro toolsets.
Familiarity with standardization and driving efficiency throughout the department.

Responsibilities

Develop IC Package Layouts for high-speed signal and high-power devices.
Work independently to resolve complex design problems.
Conduct feasibility studies for package goals in size, cost, and performance.
Implement package routing, stack-up creation, reference plane and power distribution using Cadence tools.
Provide guidance on new/methodologies to improve layout team efficiency.