Senior IC Package Layout Engineer – 2.5D/3D, Cadence Expert

Arm Limited; Chandler (AZ); Hybrid; USD 162,000 - 219,000; Full time

Job summary

Arm Limited is seeking a Senior Package Layout Engineer for the System-in-Package team to help implement next generation SoCs in IoT, Automotive, and Compute spaces. You will collaborate with teams in US, France, UK, and other Arm locations to deliver layouts that meet performance goals.

The role emphasizes solving loosely defined problems, design iteration, and strong communication across dispersed teams while enhancing package routing and high-speed signal integrity.

Qualifications

• Electrical Eng degree or equivalent experience.
• 2.5D/3D packaging experience with SI/PI requirements.
• 3–5 years using Cadence APD and Allegro toolsets.
• Promotes standardization to improve efficiency across the department.

Responsibilities

• Design, develop, and verify Arm's 2.5D/3D package layouts.
• Work on high-speed signal and high-power device layouts.
• Conduct feasibility studies for size, cost and performance goals.
• Assist in package routing, stack-up, reference planes and PD using Cadence tools.
• Provide guidance to improve layout team efficiency.

Skills

Electrical Engineering

2.5D/3D packaging

SI/PI requirements

Verbal & written comms

Education

Electrical Engineering degree

Tools

Cadence APD

Cadence Allegro

Job description

Arm Limited is seeking a Senior Package Layout Engineer for the System-in-Package team to help implement next generation SoCs in IoT, Automotive, and Compute spaces. You will collaborate with teams in US, France, UK, and other Arm locations to deliver layouts that meet performance goals.

The role emphasizes solving loosely defined problems, design iteration, and strong communication across dispersed teams while enhancing package routing and high-speed signal integrity.