Senior IC Package Design Engineer — On-Site & High-Impact

Broadcom; San Jose (CA); On-site; USD 141,000 - 226,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) matching

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

Paid holidays

Paid sick leave and vacation

Job summary

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages used in ASICs with high-speed SerDes and high-power delivery. You will help design and verify package structures for AI, networking, HPC and 5G base stations, including 224G SerDes, DDR5 and HBM, while collaborating with a global R&D team.

Your work covers signal and power integrity, manufacturability, reliability, and thermal aspects, plus contributions to efficiency improvements through process

Qualifications

• Self-management and organization skills are required.
• Strong understanding of signal/ power integrity applied to package designs.
• Cadence tools experience (APD/Allegro) or equivalent is preferred.

Responsibilities

• Overall ASIC package design responsibility including SI/PI, manufacturability, reliability and thermal.
• Package design of critical SerDes, ADC/DAC, DDR structures.
• Manage multiple projects; track progress across timelines.
• Perform general flip-chip BGA package design and engineering.
• Interface with customers and drive design projects to meet requirements.
• Contribute to design team efficiency via process improvement and automation.
• Physical design (layout) is a core responsibility.

Skills

Self-management

Organization

Education

BSEE or similar field

MSEE or similar field

Tools

Cadence APD / Allegro

Cadence SKILL

Job description

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages used in ASICs with high-speed SerDes and high-power delivery. You will help design and verify package structures for AI, networking, HPC and 5G base stations, including 224G SerDes, DDR5 and HBM, while collaborating with a global R&D team.

Your work covers signal and power integrity, manufacturability, reliability, and thermal aspects, plus contributions to efficiency improvements through process