Senior IC Package Design Engineer - High-Speed SerDes

Broadcom Inc.; San Jose (CA); On-site; USD 141,300 - 226,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

401(K) with company matching

Employee Stock Purchase Program

Job summary

Broadcom Inc. is seeking an experienced Package Design Engineer located in San Jose, CA. The role involves the design of package structures for advanced ASICs, including high-speed SerDes technologies.

The ideal candidate will have substantial experience in flip-chip-BGA package design, a solid background in signal and power integrity, as well as project management skills. This full-time position requires working on-site five days a week.

Broadcom offers a competitive salary and comprehensive benefits, including health plans and an equity program.

Qualifications

• 12+ years of experience in flip-chip-BGA package design, or 10+ years with MSEE.
• Experience in high-speed SerDes design preferred.
• Self-management and organization skills.

Responsibilities

• Design ASIC packages for various applications, including AI and HPC.
• Manage and track work across multiple projects.
• Collaborate with global teams on critical package engineering.

Skills

Package-level signal integrity

Power integrity

Project management

Design-automation coding (Cadence SKILL)

Education

BSEE or equivalent

MSEE or equivalent

Tools

Cadence APD

Job description

Broadcom Inc. is seeking an experienced Package Design Engineer located in San Jose, CA. The role involves the design of package structures for advanced ASICs, including high-speed SerDes technologies.

The ideal candidate will have substantial experience in flip-chip-BGA package design, a solid background in signal and power integrity, as well as project management skills. This full-time position requires working on-site five days a week.

Broadcom offers a competitive salary and comprehensive benefits, including health plans and an equity program.