Package Design Engineer

Broadcom; San Jose (CA); On-site; USD 141,000 - 226,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) matching

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

Paid holidays

Paid sick leave and vacation

Job summary

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages used in ASICs with high-speed SerDes and high-power delivery. You will help design and verify package structures for AI, networking, HPC and 5G base stations, including 224G SerDes, DDR5 and HBM, while collaborating with a global R&D team.

Your work covers signal and power integrity, manufacturability, reliability, and thermal aspects, plus contributions to efficiency improvements through process

Qualifications

• Self-management and organization skills are required.
• Strong understanding of signal/ power integrity applied to package designs.
• Cadence tools experience (APD/Allegro) or equivalent is preferred.

Responsibilities

• Overall ASIC package design responsibility including SI/PI, manufacturability, reliability and thermal.
• Package design of critical SerDes, ADC/DAC, DDR structures.
• Manage multiple projects; track progress across timelines.
• Perform general flip-chip BGA package design and engineering.
• Interface with customers and drive design projects to meet requirements.
• Contribute to design team efficiency via process improvement and automation.
• Physical design (layout) is a core responsibility.

Skills

Self-management

Organization

Education

BSEE or similar field

MSEE or similar field

Tools

Cadence APD / Allegro

Cadence SKILL

Job description

USA-CA San Jose Innovation Drive

USA-TX-Austin - River Place B7

USA-Colorado-Fort Collins-4380 Ziegler Road

Full time

R024439

Job Description

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

RESPONSIBILITIES

• Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.

• Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.

• Schedule, prioritize, & track your work across 2+ projects simultaneously

• General flip-chip BGA package design & engineering

• Project management and customer interface for your design projects

• Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.

• Physical design (layout) is a foundational responsibility in this role

EDUCATION/EXPERIENCE & REQUIREMENTS

• BSEE or similar field and 12+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 10+ years’ work experience

• Knowledge of package-level signal integrity and power integrity, to apply to package designs

• Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.

• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

• Self-management and organization skills

• Preferred candidates will also have 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

OTHER REQUIREMENTS

• This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position

Additional Job Description

Compensation and Benefits

The annual base salary range for this position is $141,300 - $226,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package:

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave and vacation time
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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