Senior IC Package Mechanical FEA Engineer

Broadcom; San Jose (CA); On-site; USD 108,000 - 173,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) participation including company

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

company paid holidays

paid sick leave and vacation time

Paid Family Leave

Job summary

Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.

You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid

Qualifications

• Bachelors with 8+ years of FEA experience; Masters with 6+ years; PhD with 3+ years.
• Ability to evaluate numerical simulations against first principles.
• Ability to calibrate modeling with empirical data.
• Perform mechanical testing and measurement.
• Opt for Ansys Classic/Mechanical; other tools acceptable.

Responsibilities

• Design responsibility for mechanical design aspects of ASIC packages.
• Use advanced FEA to quantify and optimize reliability and manufacturing.
• Measure and experiment to validate understanding and improve model accuracy.
• Collaborate with package designers, reliability and manufacturing partners.
• Schedule, prioritize, and track work across 4+ projects.
• Create presentations for engineers, managers, senior management, customers, vendors.
• Document design rules and guidelines.

Skills

FEA modeling

Numerical simulation

Mechanical design

Cross-functional collaboration

Presentation skills

Education

Bachelor's in Mechanical Engineering

Master's in Mechanical Engineering

PhD in Mechanical Engineering

Tools

Ansys Classic/Mechanical

Finite element software

Lab testing equipment

Job description

Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.

You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid