Senior IC Package Design Engineer

Anysilicon; Austin, Northern (TX, KY); Hybrid; USD 140,000 - 210,000; Full time

Job summary

Apple is seeking a Package Design Engineer to lead the design and integration of advanced semiconductor packages for iPhone, iPad, Mac, Apple Watch, and Apple TV. You will optimize package architecture and advance design methodologies with automation and AI.

Responsibilities include physical layout, parasitic extraction, SI/PI modeling, and collaboration with Product Design and System Architecture teams to ensure top performance and manufacturability.

Qualifications

• BS degree in a relevant field and 10+ years of industry experience.
• Proven IC package physical design experience using Cadence Allegro or Mentor Xpedition.
• Strong understanding of high-speed interface constraints and SI/PI analysis.
• Experience with HFSS or PowerSI for simulations.
• Unix/Linux environment familiarity and scripting (Python, Perl, TCL).

Responsibilities

• Perform physical layout of package substrates for diverse silicon technologies (SoC, memory, RF, cellular).
• Conduct parasitic extraction and S-parameter modeling to meet SI/PI targets.
• Collaborate with Product Design and System Architecture to assess feasibility and optimize performance.
• Drive automated design and verification flows by evaluating new CAD tools.

Skills

High-speed I/O layout

Scripting (Python/Perl/TCL)

Unix/Linux proficiency

Education

BS degree in a relevant field

Tools

Cadence Allegro

Mentor Xpedition

HFSS

PowerSI

Job description

Apple is seeking a Package Design Engineer to lead the design and integration of advanced semiconductor packages for iPhone, iPad, Mac, Apple Watch, and Apple TV. You will optimize package architecture and advance design methodologies with automation and AI.

Responsibilities include physical layout, parasitic extraction, SI/PI modeling, and collaboration with Product Design and System Architecture teams to ensure top performance and manufacturability.