Senior Failure Analysis Engineer - ICs & Packaging, Equity

NVIDIA Gruppe; Santa Clara (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Equity

Benefits package

Job summary

NVIDIA in Santa Clara, CA seeks a Failure Analysis Engineer to thyroid diagnose complex IC and packaging failures. You will apply advanced FA techniques, FIB, SEM/TEM, and cross-disciplinary knowledge to uncover root causes affecting yield and reliability.

You will collaborate with design and process teams, lead DOE evaluations, and help scale robust FA workflows for cutting-edge silicon and packaging technologies. Equity and benefits are offered.

Qualifications

• 8+ years of hands-on failure analysis experience.
• Experience with IC FA and advanced packaging.
• Strong analytical and problem-solving skills.

Responsibilities

• Lead root-cause investigations to diagnose critical failures.
• Develop and implement novel FA techniques and workflows.
• Provide precise data to support DOE and design optimization.
• Collaborate with multi-functional engineering teams.

Skills

FA domain expertise

Sample preparation

Microscopy

System-level analysis

Education

Bachelor/Master/PhD in Electrical Eng, Materials Science, Physics, or Chemistry

Tools

SEM/TEM

Job description

NVIDIA in Santa Clara, CA seeks a Failure Analysis Engineer to thyroid diagnose complex IC and packaging failures. You will apply advanced FA techniques, FIB, SEM/TEM, and cross-disciplinary knowledge to uncover root causes affecting yield and reliability.

You will collaborate with design and process teams, lead DOE evaluations, and help scale robust FA workflows for cutting-edge silicon and packaging technologies. Equity and benefits are offered.