Senior FEA Engineer, Optical Engine Packaging

CspeedIO, Inc.; Palo Alto (CA); On-site; USD 150,000 - 230,000; Full time

Job summary

Cspeed IO, Inc. seeks an experienced mechanical engineer to own structural FEA for optical engine packages, focusing on warpage prediction through assembly, interconnect stress, and lifetime models for qualification.

The role requires 6+ years in semiconductor packaging FEA, deep skills in Ansys Mechanical or Abaqus, and experience with nonlinear material behavior and fatigue life prediction, collaborating with design teams to influence architecture.

Qualifications

• 6+ years of structural FEA in semiconductor packaging.
• Nonlinear material modeling with temperature and rate effects.
• Correlation against physical measurement and distinguish modeling error from process excursion.

Responsibilities

• Predict warpage at each assembly stage including bonding, reflow, underfill, encapsulation, lid attach, and singulation.
• Analyze stress in micro-bump, copper pillar, C4, and second-level interconnects; assess fatigue life and reliability per JEDEC/IPC.
• Define simulation methodology and modeling standards; correlate predictions against measured data and provide design guidance during architecture definition.

Skills

Structural FEA

Semiconductor packaging

Viscoelasticity

Creep modeling

Fatigue life prediction

Correlation with measurements

Education

MS or PhD in Mechanical Engineering

Tools

Ansys Mechanical

Abaqus

Job description

Cspeed IO, Inc. seeks an experienced mechanical engineer to own structural FEA for optical engine packages, focusing on warpage prediction through assembly, interconnect stress, and lifetime models for qualification.

The role requires 6+ years in semiconductor packaging FEA, deep skills in Ansys Mechanical or Abaqus, and experience with nonlinear material behavior and fatigue life prediction, collaborating with design teams to influence architecture.