Senior IC Packaging Engineer - Innovative Silicon Solutions

Apple Inc.; United States; Hybrid; USD 185,000 - 325,000; Full time

Job summary

Apple Inc. in the San Francisco Bay Area, CA, is seeking a senior IC packaging engineer to design and deliver advanced packaging solutions for consumer products.

You will interface with design, quality, supply chain and suppliers to drive packaging technology from concept through high-volume manufacturing, focusing on reliability, cost, and footprint optimization. Responsibilities include defining package specs, coordinating with external suppliers, and delivering milestones on schedule, while

Qualifications

• BS degree in mechanical engineering, physics, materials science or related field with 10+ years in IC packaging.
• Experience with Wafer Level Packaging (WLP) and Wafer Bumping.
• Strong negotiation and influence skills to drive supplier performance.
• Able to manage cross-functional teams and ramp packaging to high-volume manufacturing.

Responsibilities

• Define new package characteristics based on performance, cost, and footprint.
• Define package specifications.
• Collaborate with external suppliers on design, materials, equipment, and process flow.
• Conduct proof-of-concept builds, qualification, reliability testing, and yield analysis.
• Coordinate with packaging and cross-functional teams to meet ramp schedules.
• Deliver packaging milestones on time.
• Define packaging roadmap for long-term product requirements.
• Manage suppliers' R&D activities.

Skills

Packaging engineering

AutoCAD

APD

Multi-physics simulation

Wafer bumping

Materials science

Reliability testing

DOE (Design of Experiments)

Education

BS degree in mechanical engineering, physics, materials science or related field

10+ years IC packaging experience

Tools

AutoCAD

APD

Multi-physics simulation

Job description

Apple Inc. in the San Francisco Bay Area, CA, is seeking a senior IC packaging engineer to design and deliver advanced packaging solutions for consumer products.

You will interface with design, quality, supply chain and suppliers to drive packaging technology from concept through high-volume manufacturing, focusing on reliability, cost, and footprint optimization. Responsibilities include defining package specs, coordinating with external suppliers, and delivering milestones on schedule, while