Senior DRAM Design Engineer - Next-Gen HBM Architecture

Micron Technology; Nebraska; On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology in Nebraska seeks a Senior DRAM Design Engineer to drive next‑gen 3D‑stacked memory architectures and optimization for AI workloads. You will architect, simulate and optimize DRAM designs with teams across memory systems and SoC groups.

The role requires 8+ years in DRAM design, familiarity with HBM and SPICE, and strong communication. Masters/PhD preferred; the position centers on high-performance memory development and collaboration.

Qualifications

• Strong mixed signal design experience; custom analog and synthesis flows.
• DRAM circuit design in cells/decoders/periphery/power distribution.
• Experience with SPICE-based tools and data-driven analysis.

Responsibilities

• Identify novel DRAM architectures for AI workloads to boost bandwidth and energy efficiency.
• Collaborate to identify bottlenecks and define architectural hypotheses.
• Validate hypotheses with schematic design, SPICE and tradeoff analysis for PPA feasibility.
• Partner with layout for floorplanning studies and test/yield design.
• Produce and maintain clear architecture specifications.

Skills

Mixed signal design

SPICE tools

DRAM circuit design

Communication & influence

Scripting (Python/Perl)

Education

Masters or PhD in EE/CS/CE

Tools

SPICE (FineSim/HSPICE)

Verilog

Job description

Micron Technology in Nebraska seeks a Senior DRAM Design Engineer to drive next‑gen 3D‑stacked memory architectures and optimization for AI workloads. You will architect, simulate and optimize DRAM designs with teams across memory systems and SoC groups.

The role requires 8+ years in DRAM design, familiarity with HBM and SPICE, and strong communication. Masters/PhD preferred; the position centers on high-performance memory development and collaboration.