Senior DRAM Design Engineer for HBM & AI Workloads

Micron Technology, Inc

Richardson (TX)

On-site

USD 140,000 - 200,000

Full time

14 days+

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Job summary

Micron Technology, Inc in the United States is seeking a senior DRAM circuit design engineer to identify and develop novel memory architectures, validate them with SPICE simulations, and collaborate with layout teams on floorplanning and test strategies.

Ideal candidates have 8+ years in DRAM design, experience with HBM or stacked memories, and proficiency in Verilog and Python; a Master's or PhD in EE/CS is preferred. This role offers impactful work on AI memory systems.

Qualifications

  • Strong mixed-signal design experience, including analog and synthesis flows.
  • DRAM circuit design experience in cell arrays, sense amps, decoders, IO, or power distribution.
  • Proficient with SPICE-based tools (e.g., FineSim, HSPICE) and data-driven analysis.
  • Excellent communication to influence peers.

Responsibilities

  • Identify and develop novel DRAM circuit architectures to improve bandwidth and energy efficiency.
  • Collaborate to identify bottlenecks and define architectural hypotheses.
  • Validate hypotheses via schematic-level design, SPICE, and trade-off analysis.
  • Partner with layout designers to conduct floorplanning studies.
  • Define and optimize design-for-test and design-for-yield implementations.
  • Compose and maintain clear specifications and architecture documentation.

Skills

Mixed-signal design
DRAM circuit design
Cell arrays
Sense amplifiers
Row/Column decoders
Periphery
IO
Power distribution
Communication skills

Education

Master's degree in Electrical Engineering
PhD in Electrical Engineering or related field

Tools

SPICE (FineSim, HSPICE)
Verilog
Python
Perl

Job description

Micron Technology, Inc in the United States is seeking a senior DRAM circuit design engineer to identify and develop novel memory architectures, validate them with SPICE simulations, and collaborate with layout teams on floorplanning and test strategies.

Ideal candidates have 8+ years in DRAM design, experience with HBM or stacked memories, and proficiency in Verilog and Python; a Master's or PhD in EE/CS is preferred. This role offers impactful work on AI memory systems.

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