Senior HBM Design Engineer for AI/HPC Systems

Micron; Richardson (TX); On-site; USD 120,000 - 170,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off and holidays

Income protection programs

Retirement/benefits guide

Job summary

Micron Technology seeks a Sr Design Engineer in Richardson, TX to design, simulate, and validate next‑generation HBM architectures and DRAM blocks, collaborating across global teams to optimize performance, power, area, and yield. A MS in Computer Engineering and 3+ years in DRAM design/verification are preferred.

The role involves post‑silicon bring-up support, layout coordination, and robust verification across advanced memory technologies. This is an on-site position with Micron benefits.

Qualifications

• Prior experience in HBM, DRAM, high-speed I/O, or memory-related designs.
• Familiarity with design constraints.
• Apply AI/ML-enabled tools that enhance productivity, design quality, verification coverage, and time-to-market.
• 3D-stacked architectures, TSVs, wide I/O interfaces, or PHY-adjacent logic.
• Understanding of DRAM array control and high speed circuit design.
• Experience in function verification and timing analysis with mixed signal design.
• Familiar with device reliability.
• Experienced in reliability mitigation technology and verification flow.
• Familiar with analog/digital simulation tools, i.e., HSPICE, VerilogHDL, PrimeSim.
• MS in Computer Engineering or related field.
• 3 years DRAM Design or Verification experience.
• Excellent Problem-Solving & Analytical Skills.
• Identify memory, logic, analog, or mixed-signal circuits used in HBM products, including PHY-adjacent or subsystem logic.

Responsibilities

• Design, optimize, and support post-silicon bring-up, failure analysis, and design correlation when required.
• Work closely with layout engineers on floorplanning, placement, routing, and design rule compliance.
• Review parasitics, EM/IR, and reliability results; drive design or layout fixes as needed.
• Ensure designs are manufacturable and meet foundry and packaging.
• Contribute to HBM architecture definition, block-level specifications, and design tradeoff analysis across performance, power, area, and reliability.
• Perform pre-layout and post-layout simulation, modeling, and analysis to ensure robust design margins.
• Support tape-out activities, ECOs, and reticle experiments as required.
• Participate in functional, timing, and power verification using industry-standard simulation tools.
• Collaborate closely with Design Verification teams to review test plans, debug failures, and close coverage gaps (LLM)

Skills

HBM design

DRAM design

High-speed I/O

3D stacked architecture

Power integrity

AI/ML tools

Analog/digital simulation

VerilogHDL

HSPICE

TSV signaling

RTL verification

Education

MS in Computer Engineering or related field

Tools

PrimeSim

Job description

Micron Technology seeks a Sr Design Engineer in Richardson, TX to design, simulate, and validate next‑generation HBM architectures and DRAM blocks, collaborating across global teams to optimize performance, power, area, and yield. A MS in Computer Engineering and 3+ years in DRAM design/verification are preferred.

The role involves post‑silicon bring-up support, layout coordination, and robust verification across advanced memory technologies. This is an on-site position with Micron benefits.