Hybrid IC Packaging Architect & Tech Development Lead

Advanced Micro Devices, Inc.; Austin (TX); Hybrid; USD 120,000 - 190,000; Full time

Job summary

AMD is seeking a seasoned leader in advanced packaging to drive architecture and technology development across client, server, gaming, and GPU products. You will spearhead cross-functional teams across geos, guiding concepts to qualification and communicating progress to executives.

The role emphasizes leadership in architecture, process definition, and yield improvement, with collaboration across suppliers, OSATs, and foundries. A strong track record and stellar communication are essential.

Qualifications

• Proven track record leading engineering teams in architecture definition, process definition and/or yield improvement.
• Excellent oral and written communication skills with technology partners and senior management.
• Experience in semiconductor technology development and collaboration with suppliers, OSATs and foundries.

Responsibilities

• Define package architectures in early definition stages with product architects.
• Lead new package technology development from concept to full qualification.
• Drive test-vehicle design and manufacturing to establish design rules.
• Lead yield roadmap and implement data analytics tools as required.

Skills

Leadership

Communication

Semiconductor development

Manufacturing partnerships

Yield improvement

Education

BS/MS/PhD in Materials Science/Mechanical/Engineering or related

Job description

AMD is seeking a seasoned leader in advanced packaging to drive architecture and technology development across client, server, gaming, and GPU products. You will spearhead cross-functional teams across geos, guiding concepts to qualification and communicating progress to executives.

The role emphasizes leadership in architecture, process definition, and yield improvement, with collaboration across suppliers, OSATs, and foundries. A strong track record and stellar communication are essential.