Director, Advanced Packaging & Wafer Solutions

Amkor Technology, Inc.; Tempe (AZ); Hybrid; USD 180,000 - 280,000; Full time

Job summary

Amkor Technology, Inc., the world’s largest U.S.-headquartered OSAT, seeks a Senior Director of Advanced Packaging and Wafer Services for Tempe, AZ. You will provide strategic leadership for advanced wafer-based IC packages, including 2.5D and chiplet architectures, and interface with Tier 1 customers, global R&D centers, and cross-functional teams to drive roadmaps and production ramp.

You will lead cross-functional teams across R&D, design, characterization, and operations, guiding technical

Qualifications

• Bachelor's degree in Engineering required; Master's degree or Ph.D. preferred.
• 10+ years of experience in semiconductor package development, wafer-level packaging, IC packaging, or wafer process technology.
• Demonstrated leadership in advanced packaging development programs and direct customer engagement.
• Excellent written and verbal communication skills for senior customer and internal leadership.
• Travel: 10-20% domestic and international.

Responsibilities

• Lead strategic customer engagements with Tier 1 customers, aligning requirements with the technology roadmap.
• Coordinate development activities with global R&D teams to ensure timely execution of advanced package programs.
• Serve as the senior technical and program interface for customer meetings, reviews, and issue resolution.
• Lead cross-functional teams across R&D, design, characterization, simulation, process engineering, product management, operations, and suppliers.
• Own customer product management through concept definition, feasibility, development, qualification, and initial production ramp.
• Guide technical tradeoff decisions on package architecture, wafer process integration, design rules, materials, reliability, manufacturability, cost, schedule, and yield risk.
• Engage with ecosystem partners and wafer processing suppliers to influence technology choices and roadmap direction.

Skills

Leadership

Communication

Travel willingness

Education

Bachelor's degree in Engineering

Master's degree or Ph.D. preferred

Job description

Amkor Technology, Inc., the world’s largest U.S.-headquartered OSAT, seeks a Senior Director of Advanced Packaging and Wafer Services for Tempe, AZ. You will provide strategic leadership for advanced wafer-based IC packages, including 2.5D and chiplet architectures, and interface with Tier 1 customers, global R&D centers, and cross-functional teams to drive roadmaps and production ramp.

You will lead cross-functional teams across R&D, design, characterization, and operations, guiding technical