Senior Director, Advanced Packaging & Wafer Technologies

Amkor Technology, Inc.

Phoenix (AZ)

Hybrid

USD 180,000 - 250,000

Full time

5 days ago

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Job summary

Amkor Technology, Inc. in Tempe, AZ is seeking a senior Director of Advanced Packaging and Wafer Services to lead strategic and technical roadmaps for next‑gen wafer‑based IC packages, including HDFO, 2.5D and chiplet architectures for computing, networking, AI and mobile markets.

The role is customer‑facing and will interface with Tier 1 customers, Amkor's global R&D centers and cross‑functional teams to drive program execution, development to production ramp, and technology commercialization

Qualifications

Bachelor's degree in engineering required; advanced degree preferred.
10+ years in semiconductor packaging or wafer tech development.
Proven leadership in customer-facing advanced packaging programs.
Strong-site communication and cross-functional collaboration.

Responsibilities

Lead strategic customer engagements with Tier 1 accounts and align requirements with the technology roadmap.
Coordinate development with global R&D teams to ensure timely program execution.
Interface with customers and internal teams during development, qualification, and ramp to production.
Guide architecture decisions, materials, and reliability considerations across projects.
Develop and communicate project status and roadmaps to senior leadership.