Senior Defect Engineer - Advanced Packaging & Yield

Intel Corporation

Albuquerque (NM)

On-site

USD 100,000 - 160,000

Full time

3 days ago

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Job summary

Intel Corporation's Wafer Packaging Manufacturing organization in Albuquerque, New Mexico seeks an experienced engineer to own advanced packaging layers, optimize defect inspection, classification, and drive NPI procedures.

You will analyze data, implement SPC charts, DOE, and process improvements, collaborating with tool owners and cross-functional teams to improve yield and quality in high-volume manufacturing.

Qualifications

Experience with data extraction, synthesis, and analysis using SQL and Python.
Technology transfer and NPI activities in semiconductor manufacturing.
Expertise in failure analysis and data mining to drive improvements.

Responsibilities

Own assigned advanced packaging layers and ensure defect inspection workflows are defined.
Drive ADC implementation and maintain defect classification specs.
Set up and maintain SPC charts and coordinate with cross-functional teams.

Skills

Data extraction

SQL

Python

DOE

SPC

Process improvement

Education

Bachelor's degree in engineering or related field

Master's degree in engineering or related field

PhD in engineering or related field

Tools

SQL

Python

Job description

You will analyze data, implement SPC charts, DOE, and process improvements, collaborating with tool owners and cross-functional teams to improve yield and quality in high-volume manufacturing.

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