Lead Wafer Packaging Engineer - NM Onsite

Intel Corporation; Rio Rancho (NM); On-site; USD 104,000 - 199,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation is seeking Module Engineers specialized in Wafer-Level Assembly, Die Preparation, and Metrology to support HVM and technology development at New Mexico wafer packaging operations. On-site role in Albuquerque, NM, with responsibilities spanning process transfer, equipment ramp, and cross-functional collaboration.

Ideal candidates have 4+ years in semiconductor manufacturing or a related field, with strong safety focus, problem-solving, and Lean practices.

Qualifications

• Bachelor's degree in a STEM field with 4+ years in semiconductor industry or Master's with 3+ years or PhD with relevant experience.
• Experience with process characterization, optimization, and DOE.
• Knowledge of metrology, tool qualification, and data-driven problem solving.

Responsibilities

• Drive safety and ergonomic improvements to improve equipment availability and cost efficiency.
• Collaborate with partner factories to transfer processes and maintain Copy Exactly standards.
• Develop technology roadmaps and qualify ramp equipment for new product introductions.
• Lead cross-functional task forces to solve complex technical challenges and prevent recurrence.
• Support development and pilot lines during early test vehicle and production phases.

Skills

Safety mindset

Analytical skills

Problem solving

Cross-functional teamwork

Lean principles

Education

Bachelor's degree (STEM)

Master's degree (STEM)

PhD (STEM)

Tools

DOE

Statistical software

Job description

Intel Corporation is seeking Module Engineers specialized in Wafer-Level Assembly, Die Preparation, and Metrology to support HVM and technology development at New Mexico wafer packaging operations. On-site role in Albuquerque, NM, with responsibilities spanning process transfer, equipment ramp, and cross-functional collaboration.

Ideal candidates have 4+ years in semiconductor manufacturing or a related field, with strong safety focus, problem-solving, and Lean practices.