WPM Integration: Defect Engineer

Intel Corporation; Albuquerque (NM); On-site; USD 100,000 - 160,000; Full time

Job summary

Intel Corporation's Wafer Packaging Manufacturing organization in Albuquerque, New Mexico seeks an experienced engineer to own advanced packaging layers, optimize defect inspection, classification, and drive NPI procedures.

You will analyze data, implement SPC charts, DOE, and process improvements, collaborating with tool owners and cross-functional teams to improve yield and quality in high-volume manufacturing.

Qualifications

• Experience with data extraction, synthesis, and analysis using SQL and Python.
• Technology transfer and NPI activities in semiconductor manufacturing.
• Expertise in failure analysis and data mining to drive improvements.

Responsibilities

• Own assigned advanced packaging layers and ensure defect inspection workflows are defined.
• Drive ADC implementation and maintain defect classification specs.
• Set up and maintain SPC charts and coordinate with cross-functional teams.

Skills

Data extraction

SQL

Python

DOE

SPC

Process improvement

Education

Bachelor's degree in engineering or related field

Master's degree in engineering or related field

PhD in engineering or related field

Tools

SQL

Python

Job description

Job Details

Job Description: The Wafer Packaging Manufacturing organization is a global team at the heart of Intel's advanced packaging technology and high-volume manufacturing. Our vision is clear: optimize advanced packaging HVM processes end-to-end to maximize yield, quality, and customer satisfaction. WPM spans a broad and critical portfolio - including EMIB and Foveros wafer processing, TSV reveal, C4 bumping, Die Prep, and Wafer Level Assembly - supporting Intel's most strategic technologies across multiple sites worldwide

Key Responsibilities

• Own assigned advanced packaging layer(s), ensuring all POR defect inspection, classification, and review operations are properly established with healthy inspection recipes and NPI procedures defined.
• Drive ADC implementation to ensure accurate defect classifications and maintain defect classification specs and Defect Menagerie for all assigned layers.
• Partner with metro tool owners to set up and maintain SPC charts for every defect mode and layer, create OCAPs for Metro MTs and module engineering to respond to OOC events and defect tracers.
• Own process health and product quality for the WPM manufacturing line, including defect performance, yield trends, excursions, and baseline process changes.
• Own defect excursions through resolution, including containment, wafer/lot risk assessment, disposition, root cause, downstream impact, quality events, and non-POR material.
• Drive systematic defect reduction and process improvement using process/metrology data, SORT data, DOEs, FRECLs, ATVs, and experiments with process modules.
• Co-lead cross-functional defect health reviews, including IMTs, Focus Teams, and Task Forces covering tracers, trends, OOCs, wafers-at-risk, excursions, and corrective actions.
• Extract, analyze, and correlate data to improve defects, yields, and VF matching, identifying key toolsets driving defects through analysis, MBPS, and FA.
• Quantify chronic defect gaps to goal, document roadmaps to close gaps, and ensure defect health dashboards are operational and incorporated into factory business processes.
• Communicate defect metrics and findings to module and factory stakeholders through weekly summaries and strategic quarterly reviews, while providing defect training to technicians, peers, and module teams.

Behavioral traits:

• Proven ability to lead problem-solving initiatives and process improvement projects.
• Exceptional communication skills for effectively collaborating across multidisciplinary teams.
• Passion for mentoring and fostering technical growth within teams.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. This position is not eligible for Intel immigration sponsorship.

Minimum Qualifications

• Bachelor's degree in engineering or a related field and 3+ years of experience OR Master's degree in engineering or a related field and 2+ years of experience OR PhD in engineering or a related field with no prior professional experience.
• Experienced mentioned above should be a combination of the following areas: Data extraction, synthesis, and analysis using tools such as SQL and Python.
• Technology transfer and new product introduction (NPI) activities in semiconductor manufacturing.
• Expertise in failure analysis and data mining techniques to identify trends and drive actionable improvements.

Preferred Qualifications

• Strong understanding of semiconductor process flow, equipment, and process characterization techniques.
• Experience with design of experiments (DOE), statistical process control (SPC), and process capability analysis.

We are looking for motivated individuals eager to make a meaningful impact in shaping Intel's manufacturing leadership. If you are excited about driving innovation and delivering groundbreaking solutions, we encourage you to take the next step and join our team.

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)

Primary Location: US, New Mexico, Albuquerque

Additional Locations: US, Oregon, Hillsboro

Posting Statement: All qualified applicants will receive consideration for employment w