Senior Wafer-Level Packaging Engineer

Intel Corporation; Albuquerque (NM); On-site; USD 76,000 - 146,000; Full time

Job summary

Intel Corporation in Albuquerque, NM is seeking Module Engineers for Wafer-Level Assembly, Die Preparation, and Metrology. Roles support HVM and technology development, including transfers and startups for Foveros, Embedded Bridge, and IFS.

Onsite presence is required. Responsibilities include safety and process improvements, cross-functional collaboration, and leading initiatives to ensure manufacturing readiness and robust equipment performance.

Qualifications

• Minimum education in a technical field with relevant coursework or projects.
• Experience or familiarity with semiconductor technologies and manufacturing.
• Hands-on involvement with semiconductor manufacturing equipment preferred.
• Knowledge of DoE, MBPS, SPC, and FMEA methodologies is advantageous.

Responsibilities

• Drive safety improvements and equipment availability, reducing excursions.
• Collaborate with partner factories to transfer processes and share best practices.
• Develop technology roadmaps aligning with business goals and milestones.
• Install, qualify, and ramp equipment for new product introductions and startups.
• Lead cross-functional task forces to address complex technical challenges.
• Support development and pilot lines during early testing and production phases.

Skills

Safety/compliance mindset

Analytical problem-solving

Cross-functional collaboration

Lean/continuous improvement

Education

Bachelor’s degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related technical field

Tools

DOE methodologies

MBPS

SPC

FMEA

Job description

Intel Corporation in Albuquerque, NM is seeking Module Engineers for Wafer-Level Assembly, Die Preparation, and Metrology. Roles support HVM and technology development, including transfers and startups for Foveros, Embedded Bridge, and IFS.

Onsite presence is required. Responsibilities include safety and process improvements, cross-functional collaboration, and leading initiatives to ensure manufacturing readiness and robust equipment performance.