Defect Reduction Engineer - Advanced Packaging

Intel Corporation; Rio Rancho (NM); On-site; USD 104,000 - 146,000; Full time

Job summary

Intel Corporation in Albuquerque, NM, seeks an experienced WPM Advanced Packaging Defect Reduction Engineer to protect yield and improve defect performance across high-volume packaging processes. You will partner with module engineering, manufacturing, and yield teams to deliver lasting solutions and lead cross-functional defect health reviews.

The role involves owning defect health dashboards, communicating metrics to stakeholders, and mentoring teams.

Qualifications

• Bachelor's degree in engineering or related field with 3+ years experience.
• Experience with SQL and Python for data extraction and analysis.
• Experience in semiconductor manufacturing with DOE/SPC and NPI.

Responsibilities

• Own assigned advanced packaging layer defect inspection, classification, and review processes.
• Drive ADC implementation and maintain defect classification specs and Defect Menagerie.
• Set up and maintain SPC charts for defect modes and layers; respond to OOC events.
• Own process health, yield trends, excursions, and baseline changes in WPM line.
• Lead defect excursions through containment, risk assessment, disposition, and root cause.

Skills

SQL

Python

Education

Bachelor's degree in engineering or related field

Tools

DOE

SPC

Job description

Intel Corporation in Albuquerque, NM, seeks an experienced WPM Advanced Packaging Defect Reduction Engineer to protect yield and improve defect performance across high-volume packaging processes. You will partner with module engineering, manufacturing, and yield teams to deliver lasting solutions and lead cross-functional defect health reviews.

The role involves owning defect health dashboards, communicating metrics to stakeholders, and mentoring teams.