Advanced Packaging Defect Reduction Engineer

Intel Corporation

Albuquerque (NM)

On-site

USD 104,000 - 146,000

Full time

5 days ago

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Job summary

Intel Corporation's Wafer Packaging Manufacturing team in Albuquerque is seeking an experienced Defect Reduction Engineer focused on advanced packaging defects. You will own defect classification, work with module engineering and manufacturing to strengthen processes, and drive data-driven improvements across multiple layers and tools.

You will lead cross-functional reviews, analyze yield data with SQL and Python, implement DOE and SPC methods, and mentor technicians.

Qualifications

Bachelor's degree in engineering or related field with 3+ years of experience OR Master's degree in engineering or related field with 2+ years OR PhD with no prior professional experience.
Experience with data extraction, synthesis, and analysis using SQL and Python.
Experience with technology transfer and NPI activities in semiconductor manufacturing.
Expertise in failure analysis and data mining techniques to identify trends and drive improvements.

Responsibilities

Own assigned advanced packaging layer(s) and ensure POR defect inspection and review operations are established with proper recipes and procedures.
Drive ADC implementation, maintain defect classification specs and Defect Menagerie for all layers.
Partner with tool owners to set up SPC charts, respond to OOC events, and maintain defect tracers.
Own defect excursions from containment to root cause and downstream impact; manage quality events and non-POR material.