Wafer Packaging Engineer — Advanced Tech & HVM

Intel Corporation; Albuquerque (NM); On-site; USD 104,000 - 199,000; Full time

Job summary

Intel Corporation in Albuquerque, NM is seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology to support HVM and technology development activities including transfers and start-ups for Foveros, Embedded Bridge, and IFS technologies.

Role requires onsite presence and collaboration with partner factories, engineering teams, and shift leadership to drive continuous improvement and robust manufacturing systems.

Qualifications

• Bachelor’s degree in a STEM or related engineering discipline with 4+ years of relevant semiconductor industry experience.
• Master’s degree in a STEM or related engineering discipline with 3+ years of relevant semiconductor industry experience.
• PhD in a STEM or related engineering discipline with relevant academic or research experience in semiconductor technologies, electronics, mechanical engineering, manufacturing processes, or closely related fields.
• Relevant experience may include: Semiconductor processing and manufacturing; Process characterization and optimization; Manufacturing process control methodologies; Continuous process improvement initiatives; Equipment maintenance and troubleshooting; DOE and data-driven problem solving.
• Applicable experience may be obtained through a combination of the areas listed above and does not need to be accumulated separately within each discipline.
• For candidates qualifying through the PhD pathway, relevant academic research may be considered in lieu of additional full-time industry experience.

Responsibilities

• Drive safety improvements and ergonomic enhancements to increase equipment availability and reduce costs.
• Collaborate with partner factories to transfer new processes and share best practices.
• Develop and execute technology roadmaps to meet milestones and business objectives.
• Install, qualify, and ramp equipment and processes for new product introductions and start-ups.
• Lead cross-functional teams to resolve complex technical challenges and prevent recurrence.
• Support development and pilot production lines during early test and production phases.

Skills

Analytical thinking

Problem solving

Communication

Project management

Lean manufacturing

Team collaboration

Education

Bachelor's degree in STEM/engineering

Master's degree in STEM/engineering

PhD in STEM/engineering

Job description

Intel Corporation in Albuquerque, NM is seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology to support HVM and technology development activities including transfers and start-ups for Foveros, Embedded Bridge, and IFS technologies.

Role requires onsite presence and collaboration with partner factories, engineering teams, and shift leadership to drive continuous improvement and robust manufacturing systems.