Senior Chiplet Packaging & Design Enablement Lead

Rapidus Corporation US; Santa Clara (CA); On-site; USD 140,000 - 190,000; Full time

Job summary

Rapidus Corporation US is seeking a Customer Package Design Integration Engineer to drive chiplet-based product development and packaging technology integration. You will serve as the primary technical interface between Rapidus and customers, aligning ADKs, packaging, and customer design activities toward successful tape-out.

You will combine deep expertise in 2.5D/3D packaging with program management and cross-functional coordination to lead designs from bring-up through tape-out across global

Qualifications

• B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field
• 5+ years of experience in semiconductor packaging, system design, or customer-facing engineering roles
• Strong understanding of 2.5D / 3D packaging (interposer, TSV, hybrid bonding, RDL/fan-out)
• High-speed interfaces (HBM, PCIe, UCIe, SerDes)
• Hands-on experience with package design and analysis tools (Cadence, Ansys, Synopsys, etc.)
• Proven ability to manage complex technical programs and cross-functional activities
• Strong communication skills with customer-facing experience

Responsibilities

• Guide customers in applying package design rules, libraries, and interface definitions
• Lead cross-functional integration of ADK, packaging technologies, and customer designs
• Drive 2.5D/3D package design tape-out and product realization
• Coordinate with customer engineering, ADK/Enablement, process, manufacturing, and OSAT partners
• Resolve SI/PI, package layout, and ADK usage issues, and drive root-cause analysis

Skills

2.5D/3D packaging

HBM interfaces

PCIe / UCIe / SerDes

Cadence/Ansys/Synopsys

cross-functional coordination

Education

B.S./M.S. in Electrical or related field

Tools

Cadence

Ansys

Synopsys

Job description

Rapidus Corporation US is seeking a Customer Package Design Integration Engineer to drive chiplet-based product development and packaging technology integration. You will serve as the primary technical interface between Rapidus and customers, aligning ADKs, packaging, and customer design activities toward successful tape-out.

You will combine deep expertise in 2.5D/3D packaging with program management and cross-functional coordination to lead designs from bring-up through tape-out across global