Associate Director, 3D Microelectronics Packaging

Raytheon; Tewksbury (MA); On-site; USD 157,000 - 299,000; Full time

Benefits offered by this job

Relocation assistance

Benefits package

Job summary

Raytheon Advanced Technology in the United States is seeking a multi-disciplinary Engineering Project Leader to drive the strategy and development of a microelectronics packaging portfolio, including 2.5D and 3D heterogeneous integration to increase RF and mixed-signal density.

The role will guide program capture and CRAD execution, coordinate IRAD projects across programs, mentor engineers, manage budgets, and support transitions to operations.

Qualifications

• Bachelor's degree in STEM with at least 12 years of relevant experience.
• Experience in microelectronics packaging and microelectronics design.
• Experience leading responses to solicitations (RFIs, RFPs) including white papers and/or proposals.
• Experience managing program cost, schedule, and technical performance.
• Experience leading cross-functional teams across engineering, contracts, finance, procurement/supply chain, and/or manufacturing/operations.
• Active and transferable Top Secret U.S. government issued security clearance is required prior to start with ability to obtain Top Secret/SCI clearance.

Responsibilities

• Develop capture strategies with Senior Leadership and lead project capture and management.
• Interact with customers to develop strategic microelectronic packaging opportunities, white papers, and proposals.
• Align program teams to customer priorities through requirements development and mission analysis.
• Lead trade studies for 2.5D and 3D integration to meet system needs.
• Oversee interposer fabrication and assembly strategy across Raytheon sites and suppliers.
• Guide technical white papers and proposal volumes across organizations.
• Mentor and train RF, mixed-signal, system integration, and packaging staff.
• Manage portfolio investment budget and reporting.
• Travel for customer engagements.

Skills

Microelectronics packaging

Proposal writing

Program management

Cross-functional leadership

Security clearance

Education

Bachelor's degree in STEM

MS or PhD in physics, circuits, material science, mechanical engineering, or related field

Job description

Raytheon Advanced Technology in the United States is seeking a multi-disciplinary Engineering Project Leader to drive the strategy and development of a microelectronics packaging portfolio, including 2.5D and 3D heterogeneous integration to increase RF and mixed-signal density.

The role will guide program capture and CRAD execution, coordinate IRAD projects across programs, mentor engineers, manage budgets, and support transitions to operations.