ADK Engineer: 2.5D/3D Packaging Rule Mastery

SK hynix America; San Jose (CA); On-site; USD 105,000 - 160,000; Full time

Benefits offered by this job

Top-tier health insurance

401k Matching

Educational reimbursement up to $10,00

Donations Matching

Free meals

Job summary

SK hynix America invites an experienced ADK engineer to join our Advanced Packaging R&D team onsite. You will lead ADK development and define DRC/LVS frameworks for next-generation interposer and heterogeneous integration technologies.

The role requires deep PV knowledge and strong scripting ability to automate flows across Synopsys, Cadence, and Siemens EDA tools, collaborating across package design, process, and manufacturing teams to maximize yield and reliability.

Qualifications

• Minimum 3+ years of hands-on experience in Physical Design, CAD, or PDK/ADK development within semiconductor packaging.
• Deep knowledge of design rule structures, verification methodologies and GDSII/OASIS data formats.
• Experience with sign-off tools from multiple vendors and cross-functional collaboration.

Responsibilities

• ADK Development & Maintenance: lead creation and maintenance of Assembly Design Kits for 2.5D/3D ICs and SiP.
• Rule Definition & Verification: define and debug DRC and LVS checks for package constraints.
• Cross-Functional Collaboration: partner with package design, process integration and manufacturing teams.
• Physical Verification Support: assist design teams with die-to-package integration issues.
• Flow Automation & Optimization: develop and automate verification flows using Synopsys, Cadence, and Siemens EDA tools.
• Design Flow Strategy: optimize end-to-end package design flow from concept to GDSII sign-off.

Skills

Physical Design

CAD

PDK/ADK development

Scripting for flows (Tcl/Python)

Education

B.S. or M.S. in Electrical Engineering or Computer Engineering

Tools

Synopsys IC Validator

3DICC

Cadence PVS

Virtuoso

Integrity 3D-IC

Siemens EDA Calibre

Job description

SK hynix America invites an experienced ADK engineer to join our Advanced Packaging R&D team onsite. You will lead ADK development and define DRC/LVS frameworks for next-generation interposer and heterogeneous integration technologies.

The role requires deep PV knowledge and strong scripting ability to automate flows across Synopsys, Cadence, and Siemens EDA tools, collaborating across package design, process, and manufacturing teams to maximize yield and reliability.