Lead IC Packaging Design & Layout Engineer

Draper; Cambridge (MA); On-site; USD 82,000 - 220,000; Full time

Benefits offered by this job

Workplace flexibility

Employee clubs and activities

Health and finance workshops

Off-site social events

Discounts to local museums

Job summary

Draper, an independent nonprofit R&D company in Cambridge, MA, seeks an IC Packaging Design & Layout Engineer to lead end-to-end development of advanced IC packaging solutions that meet performance, power, size, and reliability targets for Draper’s next-generation hardware platforms.

The role requires deep expertise in package architecture, high-speed layout, SI/PI analysis, and DFM, with collaboration across silicon, thermal, mechanical, and manufacturing teams to deliver manufacturable designs

Qualifications

• Deep knowledge of package architecture and high-speed layout.
• Experience with SPICE/EM/S-parameter simulations for SI/PI validation.
• DFM-oriented design for manufacturability in packaging.

Responsibilities

• Lead concept development for advanced packages (e.g., FOWLP, 2.5D/3D interposer).
• Produce detailed substrate/interposer layout and die-to-die routing.
• Own package-level SI/PI strategy and PDN design.
• Collaborate with silicon, thermal, mechanical, and manufacturing teams to deliver manufacturable designs.

Skills

High-density packaging layout

Signal integrity

SI/PI analysis

Education

Bachelor's in Electrical Engineering

Tools

Siemens Xpedition

Ansys SIwave/HFSS

HyperLynx

Job description

Draper, an independent nonprofit R&D company in Cambridge, MA, seeks an IC Packaging Design & Layout Engineer to lead end-to-end development of advanced IC packaging solutions that meet performance, power, size, and reliability targets for Draper’s next-generation hardware platforms.

The role requires deep expertise in package architecture, high-speed layout, SI/PI analysis, and DFM, with collaboration across silicon, thermal, mechanical, and manufacturing teams to deliver manufacturable designs