ASIC Package Design Project Manager

Hardware FYI; Fort Collins (CO); Hybrid; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, dental, vision

401(K) with company match

Employee stock purchase program

Job summary

Broadcom is seeking an experienced IC Package Design Project Manager to lead a team of engineers in designing complex flip-chip-BGA packages for high-speed SerDes and high-power delivery needs. The role involves global collaboration across AI, networking, HPC, and 5G programs, with opportunities to contribute to technical methodologies.

Responsibilities include planning 20+ concurrent designs, improving scheduling, and ensuring on-time delivery while aligning with design rules and

Qualifications

• Bachelor's degree required with 12+ years of related experience or Master's with 10+ years.
• Experience managing package design projects.
• Knowledge of package-level signal integrity and power integrity.
• Cooperation with worldwide team across time zones; internal and external designers.
• Strong self-management and organizational skills.
• Technical understanding of package design lifecycle and manufacturing flows.

Responsibilities

• Create and track project plans for 20+ concurrent designs (scope, schedules, resources)
• Improve scheduling methodologies and task tracking and coordination
• Organize team and customer activities to keep projects on track
• Communicate plans, status, next steps and risks
• Create technical methodologies for package design
• Steer package technology and design rules with team input
• Collaborate with customers, vendors, and cross-functional teams

Skills

Package design

Project management

SI/PI analysis

Cross-functional collaboration

Automation coding

Mechanical & Thermal modeling

Education

Bachelor's degree

Master's degree

Tools

CAD tools

Package drawings tools

Job description

Broadcom is seeking an experienced IC Package Design Project Manager to lead a team of engineers designing complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.These designs include SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support the engineering team with project management, and opportunities to contribute to technical methodologies.

RESPONSIBILITIES:

• Create and track project plans for 20+ concurrent designs (scope, schedules, resources)

• Improve scheduling methodologies and task tracking and coordination

• Organize team and customer activities to keep projects on track

• Communicate plans, status, next steps and risks

• Create technical methodologies for package design

• Steering package technology and design rules, with input from team members

• Customer, vendor, and cross-functional collaboration

EDUCATION/EXPERIENCE & REQUIREMENTS:

• Preferred candidates have previous experience managing package design projects

• Bachelors and 12+ years of related experience; or Masters degree and 10+ years of related experience

• Knowledge of package-level signal integrity and power integrity, to apply to package designs

• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

• Self-management and organization skills

• Technical understanding related to package design:

  • Package-Design lifecycle

  • How the substrate and package fit into the overall ASIC design and manufacturing flows

  • Design Data, including how it is created and used: .mcm, package spreadsheet, drawings (POD, Lid, Substrate)

  • DFx trade offs (Design for “x”, where is x is manufacturability, reliability, assurance of supply, SI/PI, etc)

  • Layout

  • SI/PI extractions and Simulations

  • Automation code development

  • Mechanical & Thermal modeling

  • Project Management

  • New Business Quotes

OTHER REQUIREMENTS

• This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position

• Occasional travel may be required

Compensation and Benefits

The annual base salary range for this position is USD To USD

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.