ASIC Package Design Engineer

Broadcom; San Jose (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grants

401(k) with company matching

Medical/dental/vision benefits

Paid holidays

Job summary

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for ASICs with high-speed SerDes and high-power delivery needs. You will join a world-wide R&D team developing high-performance package designs for AI, networking, HPC, and 5G base stations.

Responsibilities include design, SI/PI, scheduling across multiple projects, and collaboration with internal and external teams. On-site role with a competitive compensation package and bonus/equity opportunities.

Qualifications

• Requires BSEE or similar field with 12+ years in flip-chip-BGA package design, including high-speed SerDes.
• Experience with package-level SI/PI and reliable, manufacturable designs.
• Cadence APD (Allegro) or equivalent tool experience; design automation coding is a plus.

Responsibilities

• Overall design responsibility for ASIC package designs including SI/PI, manufacturability, reliability and thermal.
• Package design of SerDes, ADC/DAC, DDR, HBM, etc.
• Manage 2+ projects simultaneously and track progress.
• Perform general flip-chip BGA package design and engineering.
• Project management and customer interface for design projects.
• Improve design team efficiency through process development and automation.

Skills

Self-management

Time-zone collaboration

Project management

Design automation

Education

BSEE or similar field

MSEE or similar field

Tools

Cadence APD Allegro

Cadence SKILL

Job description

Job Description

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

RESPONSIBILITIES

• Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
• Package Design of critical structures for SerDes, ADC/DAC, DDR, HBM, etc.
• Schedule, prioritize, and track your work across 2+ projects simultaneously
• General flip-chip BGA package design and engineering
• Project management and customer interface for your design projects
• Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.
• Physical design (layout) is a foundational responsibility in this role

EDUCATION/EXPERIENCE & REQUIREMENTS

• BSEE or similar field and 12+ years' experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 10+ years' work experience
• Knowledge of package-level signal integrity and power integrity, to apply to package designs
• Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.
• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
• Self-management and organization skills
• Preferred candidates will also have 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

OTHER REQUIREMENTS

This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position.

Compensation and Benefits

The annual base salary range for this position is USD 143,800.00 To USD 230,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Equal Opportunity Statement

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

Additional Information for International Applicants

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.