Senior AI Packaging Engineer - 2.5D/3D, Equity & Bonus

Platform Recruitment; Austin (TX); Vor Ort; USD 200.000 - 400.000; Vollzeit

Benefits dieser Stelle

Equity and stock options

Annual bonus

Living-local bonus

Zusammenfassung

Platform Recruitment in Austin, TX seeks a Senior/Staff Packaging Engineer to lead advanced ASIC packaging from architecture through production readiness, collaborating with ASIC, thermal, mechanical, and systems teams.

You will drive 2.5D/3D packaging architectures, SI/PI simulations, substrate-to-board integration, and establish package design methodologies. Compensation includes $200k–$400k salary with equity and annual bonus for the right candidate.

Qualifikationen

• Deep expertise in advanced semiconductor packaging for ASICs or high-performance products.
• Front-end package design and ASIC-to-substrate integration experience.
• Hands-on 2.5D/3D packaging architecture experience.

Aufgaben

• Lead advanced package design for ASIC-to-substrate integration including bump mapping and floorplanning.
• Develop 2.5D and 3D package architectures for multi-die designs.
• Own the package design flow from concept through manufacturing support.

Kenntnisse

Semiconductor packaging

Front-end package design

2.5D/3D packaging

CAD tools (Cadence Allegro)

SI/PI simulation

Package-to-board integration

Mentoring engineers

Manufacturing support

Ausbildung

Engineering or physical sciences degree

Tools

Cadence Allegro

Siemens Xpedition

Ansys SIwave

Cadence Sigrity

Jobbeschreibung

Platform Recruitment in Austin, TX seeks a Senior/Staff Packaging Engineer to lead advanced ASIC packaging from architecture through production readiness, collaborating with ASIC, thermal, mechanical, and systems teams.

You will drive 2.5D/3D packaging architectures, SI/PI simulations, substrate-to-board integration, and establish package design methodologies. Compensation includes $200k–$400k salary with equity and annual bonus for the right candidate.