Senior Advanced Packaging Lithography Engineer

Intel Corporation; Hillsboro (OR); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Job summary

Intel seeks a Lithography Process Development Engineer to drive advanced packaging lithography, including hybrid bonding, in Hillsboro, OR. You will partner with process integration, equipment, metrology, and design teams to enable high interconnect density and yield.

The role focuses on developing and optimizing photolithography processes for backend applications, tooling integration, APC control, and defect-driven yield improvements, with a career in a cutting-edge packaging environment.

Qualifications

• Hands-on lithography process development experience with i-line, KrF or ArF lithography process development in a semiconductor fab.
• Hands-on experience with photoresist process development, including coat/bake/develop optimization, resist profile engineering, and process window characterization.
• Strong understanding of optical lithography fundamentals: aerial image formation, resist chemistry, focus-exposure matrix (FEM), depth of focus (DOF), and exposure latitude (EL).
• Proficiency in SPC and DOE principles.

Responsibilities

• Qualify scanner/stepper platforms and Track system for backend and hybrid bonding lithography applications.
• Develop, characterize, and optimize photolithography processes for back-end applications, including Cu damascene pad patterning, dielectric via and trench lithography, bonding interface layer patterning, and alignment mark / overlay target design and optimization.
• Evaluate and implement underlayer stacks to address topography challenges inherent in far backend and packaging substrates.
• Develop and optimize overlay metrology and control strategies critical for advanced packaging nodes.
• Implement APC including run-to-run and lot-to-lot overlay feedback/feedforward control loops.
• Work with integration and other modules to develop fully integrated process flows, ensuring lithography compatibility with upstream and downstream steps.
• Support yield learning by defect analysis and corrective actions for lithography-related yield detractors.
• Contribute to technology roadmap planning for next-generation node and engage with suppliers to evaluate next-generation tools and materials.

Skills

Lithography process development

i-line KrF ArF lithography

Photoresist process development

Optical lithography fundamentals

SPC & DOE

Root cause analysis

Education

Master’s degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related fields

PhD degree in the same fields

Tools

CDSEM

OCD/Scatterometry

Job description

Intel seeks a Lithography Process Development Engineer to drive advanced packaging lithography, including hybrid bonding, in Hillsboro, OR. You will partner with process integration, equipment, metrology, and design teams to enable high interconnect density and yield.

The role focuses on developing and optimizing photolithography processes for backend applications, tooling integration, APC control, and defect-driven yield improvements, with a career in a cutting-edge packaging environment.