Overlay Technology Engineer - Advanced Node Lithography

Intel Corporation

United States

Hybrid

USD 156,000 - 255,000

Full time

14 days+

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Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Oregon seeks an experienced LTD Engineer to lead research enabling advanced device architectures and overlay development. You will design and analyze experiments, push process improvements, and transfer technology to manufacturing while collaborating across cross-functional teams.

Minimum qualifications include a STEM degree with extensive lithography and overlay experience; strong DOE/SPC skills and a track record in process optimization are required.

Qualifications

Education and years of experience as listed; STEM background required.
Hands-on lithography experience and overlay development expertise.
Ability to troubleshoot overlay performance issues and perform DOE/ SPC analyses.

Responsibilities

Lead scientific research to enable innovative device architectures.
Design, execute, and analyze experiments to meet process specs.
Develop intellectual property and co-optimize process flows.
Ramp to manufacturing volumes and transfer technology to production.
Collaborate with cross-functional teams to meet targets.

Skills

Strong communication

Cross-functional teams

DOE

SPC

Data analysis

Overlay development

Lithography experience

Advanced node overlay

Education

Bachelor’s degree with 12+ years

Master’s degree with 10+ years

Ph.D. with 7+ years

Tools

ASML EUV

ASML DUV

Job description

Minimum qualifications include a STEM degree with extensive lithography and overlay experience; strong DOE/SPC skills and a track record in process optimization are required.

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