Staff Process Engineer: Advanced Packaging Lithography

Micron Technology, Inc

Boise (ID)

On-site

USD 80,000 - 110,000

Full time

14 days+
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Benefits offered by this job

Medical, dental, and vision plans
Income protection benefits
Paid family leave
Robust paid time-off program

Job summary

Micron Technology, Inc in Boise, Idaho is seeking a Process Engineer focused on Advanced Packaging Photolithography. You will develop and optimize lithography processes crucial for product quality and reliability.

The successful candidate will have strong semiconductor photolithography experience, a relevant Master's or PhD, and a passion for driving yield improvements through structured problem-solving.

Qualifications

  • Master’s or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or a related technical field.
  • 3+ years of experience in semiconductor photolithography or related process engineering.
  • Strong foundation in lithography fundamentals, including resist processing, alignment, overlay, and CD control.

Responsibilities

  • Develop and optimize photolithography processes for advanced packaging applications.
  • Drive yield improvement, defect reduction, cost optimization, and risk management.
  • Identify, diagnose, and resolve lithography-related process issues.

Skills

Semiconductor photolithography
Process optimization
Statistical methods

Education

Master's or PhD in a relevant field

Tools

Lithography tools
Track systems

Job description

Micron Technology, Inc in Boise, Idaho is seeking a Process Engineer focused on Advanced Packaging Photolithography. You will develop and optimize lithography processes crucial for product quality and reliability.

The successful candidate will have strong semiconductor photolithography experience, a relevant Master's or PhD, and a passion for driving yield improvements through structured problem-solving.

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