Staff Photolithography Engineer for Advanced Packaging

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 110,000 - 160,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Competitive 401(k) and benefits

Job summary

Micron Technology, Boise, Idaho, seeks a Staff Engineer focused on APTD Photolithography to develop and optimize lithography processes for advanced packaging, impacting yield and reliability.

Responsibilities include process optimization, DOE-driven analysis, cross‑functional collaboration, and technology transfer to manufacturing; requires 3+ years in semiconductor photolithography and advanced lithography tools.

Qualifications

• Master’s or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering.
• 3+ years of experience in semiconductor photolithography or related process engineering.
• Strong foundation in lithography fundamentals, including resist processing, alignment, overlay, and CD control.
• Experience applying DOE, SPC, and data‑driven analysis to process optimization.

Responsibilities

• Develop and optimize photolithography processes for advanced packaging applications.
• Drive yield improvement, defect reduction, cost optimization, and risk management using structured problem solving and statistical methods.
• Identify, diagnose, and resolve lithography related process issues using failure analysis and SPC.
• Lead process, equipment, and material evaluations and support qualification and baseline changes.
• Collaborate with cross‑functional teams and suppliers to enable robust integration and SMOOV transfer.

Skills

Photolithography

DOE

Statistical analysis

Cross-functional collaboration

Problem solving

Education

Master’s or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering

Tools

Lithography tools

Track systems

Metrology

Job description

Micron Technology, Boise, Idaho, seeks a Staff Engineer focused on APTD Photolithography to develop and optimize lithography processes for advanced packaging, impacting yield and reliability.

Responsibilities include process optimization, DOE-driven analysis, cross‑functional collaboration, and technology transfer to manufacturing; requires 3+ years in semiconductor photolithography and advanced lithography tools.