Module Engineer: IC Manufacturing & Process Optimizer

Intel

Hillsboro (OR)

On-site

USD 144,253 - 170,630

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Competitive pay
Stock bonuses
Health benefits
Retirement plan

Job summary

Intel in Hillsboro, Oregon seeks a Module Engineer to own and optimize complex manufacturing processes for high-volume production of advanced integrated circuits and packaging technologies. You will lead cross-functional efforts from feasibility through production, developing test programs and driving yield improvements on-site at the Intel facility.

The role emphasizes on-site collaboration, safety, quality, and cost optimization in a fast-paced semiconductor environment with global technology

Qualifications

  • Doctorate in Materials Science/Engineering or related STEM field.
  • Experience with semiconductor manufacturing processes is preferred.
  • Ability to work on-site at Intel Hillsboro.

Responsibilities

  • Lead development and optimization of manufacturing processes, equipment, and systems for high-volume production environments.
  • Conduct feasibility studies, pathfinding activities, and theoretical simulations to support innovative device architectures and process development.
  • Design, develop, and validate test programs to ensure integrated circuits function as intended and meet performance specifications.
  • Implement modifications and improvements to equipment operations targeting safety, quality, cost, productivity, and yield optimization.
  • Collaborate with equipment and material suppliers to design critical technology enablement elements and refine process requirements.
  • Execute maintenance, repair, and continuous improvement activities for production equipment and associated manufacturing components.
  • Develop roadmaps for technology solutions that align with Intel's future product needs and manufacturing capabilities.
  • Monitor product health, analyze performance data, and resolve yield issues through systematic troubleshooting and root cause analysis.
  • Lead technology transfer initiatives to global manufacturing sites through training programs and process standardization.
  • Establish material specifications and quality standards while interfacing with supplier quality and procurement teams.
  • Drive standardization in manufacturing quality systems, product qualification methods, and process documentation.
  • Support factory production commitments by resolving discrepant material issues and containing quality excursions.

Skills

Manufacturing process optimization
Cross-functional collaboration
Data analysis & troubleshooting
Project planning

Education

Doctorate degree in Materials Science & Engineering or related STEM field

Job description

Intel in Hillsboro, Oregon seeks a Module Engineer to own and optimize complex manufacturing processes for high-volume production of advanced integrated circuits and packaging technologies. You will lead cross-functional efforts from feasibility through production, developing test programs and driving yield improvements on-site at the Intel facility.

The role emphasizes on-site collaboration, safety, quality, and cost optimization in a fast-paced semiconductor environment with global technology

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Module Engineer: IC Manufacturing & Process Innovation
Module Engineer: IC Manufacturing & Process Innovation

PVH (Tommy Hilfiger/Calvin Klein) • Hillsboro (OR)

On-site
USD 144,253 - 170,630
Module Development Engineering Leader
Module Development Engineering Leader

Intel Corporation • Hillsboro (OR)

On-site
USD 134,000 - 220,000
Stock bonuses
Health benefits
Vacation
+1
Module Development Engineer - Advanced Packaging
Module Development Engineer - Advanced Packaging

Intel • Hillsboro (OR)

On-site
USD 155,000 - 220,000
Foundry Module Development Engineer: Process Innovation
Foundry Module Development Engineer: Process Innovation

Intel Corporation • Hillsboro (OR)

Hybrid
USD 134,000 - 255,000
Health plan
Wellness program
Time off
+2
Module Engineer
Module Engineer

Intel • Hillsboro (OR)

On-site
USD 144,000 - 171,000
Competitive pay
Stock bonuses
Health benefits
+1
Semiconductor Process Innovation Engineer
Semiconductor Process Innovation Engineer

Intel • Hillsboro (OR)

On-site
USD 133,800 - 188,890
Module Engineer
Module Engineer

Intel Corporation • Hillsboro (OR)

On-site
USD 144,253 - 170,630
Semiconductor Manufacturing Engineer — On-Site Process Innovator
Semiconductor Manufacturing Engineer — On-Site Process Innovator

Intel • Hillsboro (OR)

On-site
USD 140,000 - 171,000
Stock bonuses
Health benefits
Retirement plan
+1
Senior Thin Film Engineer — Process Innovation & Manufacturing
Senior Thin Film Engineer — Process Innovation & Manufacturing

Intel Corporation • Hillsboro (OR)

Hybrid
USD 133,800 - 255,200
Competitive pay
Stock bonuses
Health and retirement benefits
+1
Senior CMP Module Lead for High-Volume Manufacturing
Senior CMP Module Lead for High-Volume Manufacturing

Intel Corporation • Hillsboro (OR)

On-site
USD 211,000 - 298,000
Competitive pay
Stock bonuses
Health benefits