Advanced Package Development Engineer

Apple; San Francisco (CA); On-site; USD 185,000 - 325,000; Full time

Job summary

Apple's Advanced Packaging Program in San Francisco seeks engineers to drive package integration and technology development for next‑generation products. You will work with world‑class engineers to translate 2.5D/3D packaging concepts from concept to mass production.

You will collaborate with foundries, define specs, run DOEs and NPIs, lead tapeouts, and apply data analytics to optimize yield and reliability while shaping packaging architectures and DFM with IC layout tools.

Qualifications

• BS and 10+ years of experience in relevant industry experience.
• MS/PhD with 6+ years in advanced wafer-level packaging.
• Deep expertise in advanced packaging architectures and foundry processes.
• Hands-on experience reviewing GDS/layout data, physical verification (DRC/LVS), and tools like Calibre/Virtuoso/KLayout.
• Proven track record managing foundry partners, DOEs, NPIs, and metrology analysis.
• Solid background in packaging physics and multi‑domain interactions.

Responsibilities

• Collaborate across domains to meet electrical, mechanical, and thermal specs.
• Drive process definition, baseline flow, and margin with foundry partners.
• Lead TV definition, floorplanning, tapeout, and DOE plans with foundries.
• Review layout data and ensure DFM alignment with design rules.
• Collect data, analyze yield, and track wafer-level metrics.
• Investigate failures and root causes of process excursions.
• Apply AI/ML to convert metrology data into optimization insights.

Skills

Advanced packaging

Packaging integration

Data analysis

Cross-functional collaboration

DOE development

Education

BS

MS/PhD

Tools

GDSII

OASIS

Calibre

Virtuoso

KLayout

Job description

San Francisco Bay Area, California, United States Hardware

Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.

Description

• You will be responsible for advanced packaging development and pathfinding.
• Drive engagement with leading-edge foundries/OSATs to lead package integration, process definition, and architecture efforts.
• Define specs, drive process windows, and establish advanced packaging solutions (2.5D/3D, hybrid bonding, high-density wafer-level interconnects).

Responsibilities

• Collaborate with cross-functional domains through the package architecture and definition process to deliver optimized solutions meeting electrical, mechanical, and thermal requirements.
• Drive process definition, baseline flow development, and margin validation in close collaboration with foundry/OSAT partners.
• Lead test vehicle (TV) definition, floorplanning, tapeout execution, and DOE build plans with foundries through development and NPI phases.
• Perform layout and GDS/mask review (GDSII/OASIS), ensuring DRC/LVS compliance and design-for-manufacturing (DFM) alignment with foundry design rules.
• Lead comprehensive data collection, statistical data analysis, and yield tracking across wafer-level process steps to drive yield enhancement and process centering.
• Drive failure analysis (FA), root-cause investigations, and issue resolution for wafer-level process excursions, defectivity, and reliability marginalities.
• Apply advanced data analytics and AI/ML techniques to convert complex foundry inline/metrology datasets into actionable process optimization insights.

Minimum Qualifications

• BS and 10+ years of experience in relevant industry experience.

Preferred Qualifications

• MS/PhD and 6+ years of relevant industry experience in advanced wafer-level packaging.
• Deep technical expertise in advanced packaging architectures and foundry processes
• Hands-on experience reviewing GDS/layout data, physical verification (DRC/LVS), and working with IC layout/viewing tools (e.g., Calibre, Virtuoso, KLayout).
• Proven track record managing foundry partners, defining DOEs, driving NPI engineering builds, and analyzing inline/end-of-line metrology and electrical test data.
• Solid background in packaging physics, multi-domain interactions (thermo-mechanical, warpage, thin-wafer handling, reliability, and SI/PI fundamentals).
• Strong problem-solving, analytical rigor, and communication skills to interface effectively with cross-functional and overseas foundry/OSAT partners.

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.

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Apple accepts applications to this posting on an ongoing basis.