Senior Advanced Packaging Architect: 2.5D/3D ICs

OLIX; Austin (TX); Vor Ort; USD 180.000 - 300.000; Vollzeit

Benefits dieser Stelle

Equity

Living-Local Bonus

Zusammenfassung

OLIX is seeking an Advanced Packaging Architect to own packaging technology direction for the DX-1 accelerator and future products. You will drive package architecture, detailed design, layout, simulation, and product readiness while shaping the strategy and ecosystem for next-generation packaging.

In this high-impact role you will lead cross-functional packaging activities, mentor engineers, and build the packaging function as the programme scales.

Qualifikationen

• Ten+ years in advanced semiconductor packaging for ASIC/high-performance products.
• Proven ownership of packaging architecture, technology strategy, or roadmap development.
• Deep front-end package design expertise including ASIC-to-substrate integration.
• Experience with 2.5D/3D packaging and multi-die/heterogeneous integration.
• Hands-on capability with package design tools (Cadence/Siemens).
• Experience leading packaging development across layout, simulation, verification, and release.

Aufgaben

• Own and define advanced package architecture and design for ASIC-to-substrate integration.
• Lead 2.5D/3D packaging architectures for future OLIX products, including multi-die interfaces.
• Define package structures meeting electrical, thermal, mechanical, reliability, and manufacturability requirements.
• Own full package design flow from concept to manufacturing support.

Kenntnisse

Advanced packaging

Architecture strategy

2.5D/3D packaging

PI/SI simulation

Team leadership

Ausbildung

Engineering degree

Tools

Cadence Allegro X APD

Siemens Xpedition

Ansys SIwave

Cadence Sigrity

Jobbeschreibung

OLIX is seeking an Advanced Packaging Architect to own packaging technology direction for the DX-1 accelerator and future products. You will drive package architecture, detailed design, layout, simulation, and product readiness while shaping the strategy and ecosystem for next-generation packaging.

In this high-impact role you will lead cross-functional packaging activities, mentor engineers, and build the packaging function as the programme scales.