Advanced Packaging Lead Architect for AI Interconnects

Mixx Technologies, Inc.; San Jose (CA); On-site; USD 150,000 - 210,000; Full time

Job summary

Mixx Technologies is seeking an Advanced Packaging Lead Architect to define the mechanical and structural roadmap for next-generation optical interconnects. Lead the architecture of 2.5D, 3D, and 3.5D packaging, balancing thermal-mechanical stability, signal integrity, and manufacturability across heterogeneous integration structures.

You will lead cross-functional teams, drive DOE and FEA validation, and mitigate reliability risks such as warpage and delamination, shaping AI infrastructure

Qualifications

• BS/MS/PhD in Mechanical Engineering, Materials Science, or related field.
• 12+ years of experience in advanced semiconductor packaging architecture focusing on thermo-mechanical reliability.
• Expert knowledge of 2.5D/3D IC integration, MCM, and heterogeneous integration technologies.

Responsibilities

• Define the architectural strategy for advanced multi-die systems, including silicon/organic interposers, TSVs, and micro-bump configurations.
• Lead thermal-mechanical co-design efforts, establishing the framework for warpage mitigation and CTE mismatch management across complex material interfaces.
• Drive DOE and tolerance analysis at the system level to ensure robust performance under extreme manufacturing and thermal cycling conditions.
• Oversee advanced FEA methodologies, ensuring that simulation models for thermal stress and mechanical strain are validated against experimental reliability data.
• Collaborate with executive leadership and cross-functional teams to translate product requirements into scalable packaging architectures.
• Mitigate high-level reliability risks, such as delamination and solder fatigue, by identifying critical material interactions early in the design cycle.
• Mentor mechanical and packaging engineers in executing detailed simulations and layout optimizations.

Skills

2.5D/3D IC integration

MCM (Multi-Chip Modules)

Heterogeneous integration

ANSYS Mechanical

Thermal-structural analysis

Warpage management

DOE & tolerance analysis

Team leadership

Education

BS/MS/PhD in Mechanical Engineering or Materials Science

Tools

ANSYS Mechanical

Job description

Mixx Technologies is seeking an Advanced Packaging Lead Architect to define the mechanical and structural roadmap for next-generation optical interconnects. Lead the architecture of 2.5D, 3D, and 3.5D packaging, balancing thermal-mechanical stability, signal integrity, and manufacturability across heterogeneous integration structures.

You will lead cross-functional teams, drive DOE and FEA validation, and mitigate reliability risks such as warpage and delamination, shaping AI infrastructure