Advanced Packaging Architect — Equity Options & Impact

Olix Computing Ltd.; Austin (TX); On-site; USD 180,000 - 280,000; Full time

Benefits offered by this job

Stock options

Living-Local bonus

Job summary

OLIX Computing Ltd. is seeking an Advanced Packaging Architect to own packaging architecture, roadmap, and execution for the DX-1 decode accelerator.

You will shape 2.5D/3D packaging, drive from concept through manufacturing, and define the strategy in collaboration with cross-functional teams. This high-impact role combines hands-on engineering with architectural leadership, including building the packaging function as the programme scales and partnering with OSATs, foundries, and substrate

Qualifications

• 10+ years in advanced semiconductor packaging for ASIC/high-performance products
• Ownership of packaging architecture, technology strategy, or roadmap
• Deep expertise in front-end package design
• Experience with 2.5D/3D packaging and multi-die integration
• Hands-on with packaging design tools (Cadence/Siemens)
• Experience leading package development across layout, simulation, verification, release
• Strong PI/SI simulation capability for package-level analysis
• Experience collaborating with vendors/OSATs and foundries
• Ability to build packaging capability, processes, or teams
• Exposure to new product introductions and scaling packaging tech

Responsibilities

• Own package architecture and design for ASIC-to-substrate integration
• Lead 2.5D/3D packaging development for future variants
• Define package structures meeting electrical/thermal/reliability/ manufacturability requirements
• Translate requirements into design rules, routing constraints, and implementations
• Own full package design flow from concept to release and manufacturing support
• Develop and review package layouts, die placement, routing, power/ground distribution
• Lead PI/SI simulations and translate results into design improvements
• Support package-to-board co-design and interfaces when required
• Ensure alignment between die, package, substrate, and board implementation
• Build and lead packaging capability, processes, and teams as programs scale
• Collaborate with substrate vendors, OSATs, foundries on stackups and feasibility
• Maintain manufacturability, reliability, and qualification workflows

Skills

Packaging architecture

Technology strategy

Front-end package design

2.5D/3D packaging

Multi-die integration

Cadence Allegro X APD

Ansys SIwave

Cadence Sigrity

Team leadership

Vendor partnerships

Education

Engineering or physical sciences degree

Tools

Cadence Allegro X APD

Siemens Xpedition

Ansys SIwave

Cadence Sigrity

Job description

OLIX Computing Ltd. is seeking an Advanced Packaging Architect to own packaging architecture, roadmap, and execution for the DX-1 decode accelerator.

You will shape 2.5D/3D packaging, drive from concept through manufacturing, and define the strategy in collaboration with cross-functional teams. This high-impact role combines hands-on engineering with architectural leadership, including building the packaging function as the programme scales and partnering with OSATs, foundries, and substrate