Packaging Architect Austin, TX, London, UK and Bristol, UK

Olix Computing Ltd.; Austin (TX); On-site; USD 180,000 - 280,000; Full time

Benefits offered by this job

Stock options

Living-Local bonus

Job summary

OLIX Computing Ltd. is seeking an Advanced Packaging Architect to own packaging architecture, roadmap, and execution for the DX-1 decode accelerator.

You will shape 2.5D/3D packaging, drive from concept through manufacturing, and define the strategy in collaboration with cross-functional teams. This high-impact role combines hands-on engineering with architectural leadership, including building the packaging function as the programme scales and partnering with OSATs, foundries, and substrate

Qualifications

• 10+ years in advanced semiconductor packaging for ASIC/high-performance products
• Ownership of packaging architecture, technology strategy, or roadmap
• Deep expertise in front-end package design
• Experience with 2.5D/3D packaging and multi-die integration
• Hands-on with packaging design tools (Cadence/Siemens)
• Experience leading package development across layout, simulation, verification, release
• Strong PI/SI simulation capability for package-level analysis
• Experience collaborating with vendors/OSATs and foundries
• Ability to build packaging capability, processes, or teams
• Exposure to new product introductions and scaling packaging tech

Responsibilities

• Own package architecture and design for ASIC-to-substrate integration
• Lead 2.5D/3D packaging development for future variants
• Define package structures meeting electrical/thermal/reliability/ manufacturability requirements
• Translate requirements into design rules, routing constraints, and implementations
• Own full package design flow from concept to release and manufacturing support
• Develop and review package layouts, die placement, routing, power/ground distribution
• Lead PI/SI simulations and translate results into design improvements
• Support package-to-board co-design and interfaces when required
• Ensure alignment between die, package, substrate, and board implementation
• Build and lead packaging capability, processes, and teams as programs scale
• Collaborate with substrate vendors, OSATs, foundries on stackups and feasibility
• Maintain manufacturability, reliability, and qualification workflows

Skills

Packaging architecture

Technology strategy

Front-end package design

2.5D/3D packaging

Multi-die integration

Cadence Allegro X APD

Ansys SIwave

Cadence Sigrity

Team leadership

Vendor partnerships

Education

Engineering or physical sciences degree

Tools

Cadence Allegro X APD

Siemens Xpedition

Ansys SIwave

Cadence Sigrity

Job description

AI is growing faster than any technology in history and the explosion in demand has created a massive infrastructure gap; we can no longer build chips or power stations fast enough to keep up. The industry is still leaning on a ten-year-old hardware blueprint that has reached its limit. A new paradigm that is faster and more efficient will be the biggest economic opportunity of the next century and create the most important company of the next decade. The OLIX Decode Accelerator 1 (DX-1) is the first accelerator architected specifically for decode. Rack-scale co-design of logic, data movement, packaging, optics and interconnect enables a step change in system level performance.

The Role:

At OLIX, the performance of our technology depends not only on silicon design, but on how effectively that silicon is packaged, integrated, and scaled into products. Packaging is a first-class element of our rack-scale co-design philosophy, and over successive product generations it will become one of our most important sources of system-level differentiation.

The Advanced Packaging Architect will own OLIX's packaging technology direction: defining the packaging architecture and roadmap across current and future products, and delivering the packaging solutions that turn our ASICs into high-performance systems.

The DX-1 provides the foundation, with a well-bounded packaging scope that must be executed to a high standard on an aggressive schedule. Beyond DX-1, our roadmap moves rapidly toward significantly more advanced packaging, with the potential for denser multi-die and chiplet-style integration, 2.5D and 3D architectures, and progressively more advanced optical integration. This role shapes that trajectory and lays the foundation for future products that will fast-follow DX-1.

This is a high-impact role combining hands-on engineering with architectural and strategic ownership. You will lead packaging across the full development flow for DX-1, including package architecture, detailed design, layout, simulation, and product readiness, while simultaneously defining the packaging technology strategy, partner ecosystem, and internal capability that future generations will require. As the programme scales, you will have the opportunity to build the packaging function and team around you.

Responsibilities:

Advanced Package Architecture & Design

Own package architecture and design for ASIC-to-substrate integration, including bump/pad mapping, substrate escape, interconnect strategy, package floorplanning, and stack-up definition

Lead the development of 2.5D and 3D package architectures for future OLIX product variants, including multi-die integration, chiplet-style interfaces, and heterogeneous integration approaches

Define package structures that meet electrical, thermal, mechanical, reliability, and manufacturability requirements

Translate silicon and system requirements into practical package design rules, routing constraints, and implementation strategies

Full Package Design Flow

Own or direct the full package design flow, from concept definition through detailed design, analysis, layout, verification, release, and manufacturing support

Develop and review package layouts including die placement, substrate routing, power/ground distribution, high-speed interface breakout, and physical integration constraints

Own or direct PI/SI simulation activities to validate signal integrity, power delivery, and package performance, translating results directly into design improvements and sign-off decisions

Support package-to-board co-design, including substrate layout and PCB layout/interface definition where required

Ensure strong alignment between die, package, substrate, and board-level implementation

Oversee package database management, design reviews, sign-off, and release readiness

Capability & Team Building

Establish OLIX's packaging engineering capability: methodologies, design libraries, templates, rules, tool flows, and workflows that support efficient and repeatable development across product generations

Define the hiring roadmap for the packaging function and, as the programme scales, build and lead a team of packaging engineers while remaining a hands‑on technical contributor

Support tool flow development and integration across package, substrate, simulation, and PCB environments

Cross-Functional Engineering

Work closely with ASIC, optics, mechanical, thermal, and systems engineers to optimise package performance and system integration

Collaborate with substrate vendors, OSATs, foundries, and external partners on stack-ups, design rules, implementation feasibility, and manufacturing readiness

Ensure package design decisions support broader product requirements including manufacturability, reliability, serviceability, and scale

Act as the key interface between package design and adjacent engineering domains

Manufacturing & Productisation Support

Ensure package designs are aligned with assembly, qualification, reliability, and manufacturing requirements

Lead DFM/DFX activities for advanced package technologies and substrate implementations

Support prototype build, bring‑up, qualification, and early production with strong technical ownership of packaging‑related issues

Participate in root cause analysis and corrective action for packaging or integration issues identified during build, test, or reliability assessment

Review substrate deliverables, fabrication outputs, and manufacturing documentation for completeness and technical quality

Skills & Experience

10+ years' experience in advanced semiconductor packaging for ASIC or other high-performance products

Demonstrated ownership of packaging architecture, technology strategy, or roadmap development for complex products

Deep expertise in front-end package design, including ASIC-to-substrate integration

Strong experience with 2.5D and/or 3D package architectures, including multi-die and heterogeneous integration

Strong hands‑on capability with package design tools such as Cadence Allegro X APD, Siemens Xpedition, or equivalent

Experience leading package development across layout, simulation, verification, and release

Strong PI/SI simulation capability, including package-level signal integrity and power delivery analysis using tools such as Ansys SIwave, Cadence Sigrity, or equivalent

Experience in substrate design and package-to-board integration

Experience building packaging capability, processes, or teams, or leading engineers while remaining a hands‑on contributor

Strong working relationships with substrate vendors, OSATs, and foundry packaging organisations

Good understanding of manufacturability, interconnect technologies, and package reliability

Strong technical judgement, communication, and problem-solving skills

Degree in a relevant engineering or physical sciences discipline

Experience with AI accelerators, high-performance compute, networking, or advanced data-centre hardware

Familiarity with wafer-level packaging and emerging advanced packaging platforms

Exposure to optical or photonic integration with electronic packaging

Familiarity with package reliability, qualification, and failure analysis workflows

Exposure to new product introduction and scaling advanced package technologies into production

Compensation & Equity

Competitive Salary: commensurate with your experience, skills, and location.

Equity & Ownership: Meaningful stock options. You're not just joining the mission; you're owning a piece of it.

Proximity Bonus: We value your time. To minimise your commute and maximise your life, we offer an annual Living-Local Bonus if your residence is within 20 minutes of the office.