Senior 3DIC AMS/IVR Design Flow Engineer

TSMC - Taiwan Semiconductor Manufacturing Company Limited; California; On-site; USD 153,000 - 250,000; Full time

Job summary

TSMC is seeking an Analog & Mixed-Signal / 3DIC Design Flow Engineer to lead IVR flow development for advanced 3DIC technologies. The role requires deep AMS/3DIC expertise and collaboration with EDA vendors to enable tool features and scripts.

The successful candidate will contribute to power delivery for AI/HPC workloads, enabling integration into GPU/SoC platforms across global teams and locations.

Qualifications

• 15+ years of proven experience in analog and mixed-signal design with PMIC/IVR focus.
• 3DIC integration and analog flow development experience.
• Proven ability to work with multiple EDA tools and vendors.

Responsibilities

• Develop AMS/3DIC design flows compatible with TSMC PDKs, focusing on IVR integration.
• Construct schematic and simulation methodologies for 3DIC analog design.
• Collaborate with EDA vendors to enable and enhance tool features, building customized design scripts.
• Deliver flows optimized for large-scale GPU/SoC integration to support customer tape-outs.
• Work with cross-functional teams to define specifications and requirements.
• Stay current with IVR, AMS, and 3DIC trends to shape future design methods.

Skills

AMS/3DIC design

IVR flow development

Cadence/Synopsys/Ansys

Schematic & simulation

Python/Perl/SKILL/TCL

Cross-functional collaboration

Education

Master's or Ph.D. in Electrical Engineering/Computer Engineering

Job description

TSMC is seeking an Analog & Mixed-Signal / 3DIC Design Flow Engineer to lead IVR flow development for advanced 3DIC technologies. The role requires deep AMS/3DIC expertise and collaboration with EDA vendors to enable tool features and scripts.

The successful candidate will contribute to power delivery for AI/HPC workloads, enabling integration into GPU/SoC platforms across global teams and locations.