Advanced Packaging Modeling Engineer

GlobalFoundries

Town of Malta (NY)

On-site

USD 98,000 - 176,000

Full time

14 days+
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Job summary

GlobalFoundries in Malta, NY seeks an experienced mechanical, thermal or electrical modeler/engineer to address 3DHI and advanced packaging questions across logic, RF, analog and memory tech. This role focuses on using commercial modeling tools to guide device integration and 3DHI optimizations for mechanical, thermal or electrical performance.

You will collaborate with cross-functional teams to drive 3DHI technology decisions and ensure robust packaging solutions in a fast-paced semiconductor

Qualifications

  • MS degree with 5+ years of relevant experience
  • PhD with 3+ years of relevant experience
  • Experience using semiconductor mechanical/thermal/electrical simulation tools (e.g., Ansys Mechanical Workbench)
  • Overall GPA 3.0 or higher; good academic standing
  • Fluent English (written & verbal)
  • Solid understanding of semiconductor processes and integration techniques
  • Strong computer/software skills and ability to present results

Responsibilities

  • Familiarity with commercial software for mechanical/thermal/electrical modeling
  • Stress simulations for active areas and their impact on device performance
  • Anticipate integration/process issues from information from teams
  • Facilitate discussions to identify simulations that highlight critical process interactions
  • Apply commercial simulation software to mimic semiconductor process flows
  • Interact with integration, device, and design engineers to ensure working technology

Skills

Strong communication skills
Presentation skills
Collaboration with cross-functional团队

Education

MS degree
PhD

Tools

Ansys Mechanical Workbench
Other semiconductor modeling tools
LVS and DRC verification tools

Job description

We are looking for an experienced mechanical, thermal or electrical modeler / engineer to address 3DHI and advanced packaging questions for a wide range of logic, RF, analog and memory technologies. This person will focus upon the use of commercial modeling tools for guiding device, integration and 3DHI advanced packaging optimizations for mechanical, thermal or electrical performance optimizations.

About GlobalFoundries

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

We are looking for an experienced mechanical, thermal or electrical modeler / engineer to address 3DHI and advanced packaging questions for a wide range of logic, RF, analog and memory technologies. This person will focus upon the use of commercial modeling tools for guiding device, integration and 3DHI advanced packaging optimizations for mechanical, thermal or electrical performance optimizations.

Work Location:

This position is for a role in our state-of-the-200mm fabrication facility in Malta, New York.

Essential Responsibilities
  • Familiarity with commercial software for mechanical or thermal or electrical modeling.
  • Stress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling.
  • Anticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling.
  • Facilitate discussion with originating team to identify simulations that highlight critical process interactions and drive optimal 3DHI technology decisions.
  • Apply commercial simulation software to mimic semiconductor process flows and highlight the areas of concern.
  • Extensive interaction with integration, device, and design engineers to assure development of a working technology
Other Responsibilities
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
  • Other duties as assigned by manager.
Required Qualifications
  • M.S. + minimum of 5 years of relevant experience
  • PhD + minimum of 3 years of relevant experience
  • Semiconductor mechanical or thermal or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software for any of those 3 modeling applications
  • Must have at least an overall 3.0 GPA and proven good academic standing.
  • Language Fluency - English (Written & Verbal).
  • Solid understanding of semiconductor processes and integration techniques
  • Good computer / software skills
  • Ability to clearly present results to small and large groups
Preferred Qualifications
  • PhD + 5 years of relevant experience
  • Thermal and electrical simulation for specific IC circuit designs (RF analog experience preferred) and with LVS and DRC verification tools (Cadence / Mentors Graphics / Keysight ADS…)
  • Demonstrated work performance in an environment requiring a high level of attention to detail and timeliness.
  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
  • Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning & organizational skills.
Expected Salary Range

$98,000.00 - $176,000.00

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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