Senior Cryogenic Packaging Modeling Engineer

GLOBALFOUNDRIES U.S. 2 LLC; Essex Junction (VT); On-site; USD 118,000 - 239,000; Full time

Job summary

GlobalFoundries is seeking an experienced thermal, mechanical, and/or electrical modeler/engineer with cryogenic modeling experience to support cryogenic packaging and system co-optimization R&D. You will build, correlate, and apply models for low-temperature behavior to guide 3DHI packaging optimizations.

The role involves extensive collaboration with integration, device, and design teams to ensure robust technology development and effective decision-making across mechanical, thermal, and

Qualifications

• M.S. + minimum of 10 years of relevant experience.
• Semiconductor mechanical, thermal and/or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software.
• Strong problem solving and technical trouble shooting skills includingexpertisein design of experiment.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal).
• Solid understanding of semiconductor processes and integration techniques.
• Travel - Up to10%.

Responsibilities

• Demonstrated experience using commercial software to develop and correlate cryogenic thermal, mechanical, and/or electrical models for semiconductor devices and advanced packages (e.g., 77 K and below), including temperature-dependent material properties and boundary conditions.
• Stress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling.
• Anticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling.
• Facilitate discussion with originating team to identify simulations that highlight critical process interactions and drive optimal 3DHI technology decisions.
• Apply commercial simulation software to mimic cryogenic semiconductor process flows and highlight the areas of concern.
• Extensive interaction with integration, device, and design engineers to assure development of a working technology.

Skills

Problem solving

Design of experiments

Communication skills

Leadership

Education

Master's degree

PhD (preferred)

Tools

Ansys Mechanical Workbench

Cadence

Mentor Graphics

Keysight ADS

Job description

GlobalFoundries is seeking an experienced thermal, mechanical, and/or electrical modeler/engineer with cryogenic modeling experience to support cryogenic packaging and system co-optimization R&D. You will build, correlate, and apply models for low-temperature behavior to guide 3DHI packaging optimizations.

The role involves extensive collaboration with integration, device, and design teams to ensure robust technology development and effective decision-making across mechanical, thermal, and