Senior 3D Heterogeneous Integration Process Engineer

Tokyo Electron Limited; City of Albany (NY); On-site; USD 123,806 - 174,945; Full time

Benefits offered by this job

Medical Vision and Dental Insurance

Paid Personal Leave

Holiday Time

401k Retirement Plans and Employer...

Tuition Reimbursement

Incentives for Healthy Lifestyles

Employee Assistance Programs

Job summary

Tokyo Electron Limited is seeking a Senior Heterogeneous Integration Process Engineer for its Albany, NY location. You will lead R&D programs in 3DI technologies, including C2W, D2W, and wafer bonding, and collaborate with global teams to translate fundamental research into scalable process and equipment solutions.

The role requires a Ph.D. and 5+ years of semiconductor R&D, with strong expertise in advanced packaging and 3D integration, plus hands-on bonding experience and excellent

Qualifications

• Ph.D. in Materials Science, Mechanical, Chemical, Electrical Engineering, Physics, Chemistry, Nanotechnology, or a related field.
• 5+ years of semiconductor R&D experience.
• Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
• Hands-on experience in wafer bonding, process integration, or related semiconductor technologies.
• Proven problem-solving, analytical, and experimental skills.
• Strong project management and organizational capabilities.
• Understanding of semiconductor technology roadmaps and industry trends.
• Excellent verbal and written communication skills.
• Strong record of technical innovation through publications, patents, or industry contributions.
• Demonstrated leadership in cross-functional technical programs.
• Ability to work effectively in a multicultural and global environment.

Responsibilities

• Lead R&D programs in advanced 3DI technologies, including C2W, D2W, and wafer bonding.
• Define technical strategy and align R&D activities with business objectives.
• Collaborate with global teams, customers, and joint development partners.
• Conduct fundamental research and develop innovative processes and hardware solutions.
• Evaluate technology feasibility through modeling, simulation, and experimentation.
• Drive technology pathfinding for heterogeneous and 3D device integration.
• Mentor researchers and foster technical excellence across the organization.
• Provide technical leadership for customer engagements and internal development programs.
• Communicate technical results and recommendations to key stakeholders.

Skills

Heterogeneous integration

Wafer bonding

Process integration

Semiconductor R&D

Analytical skills

Project management

Cross-functional collaboration

Communication skills

Leadership

Multicultural teamwork

Education

Ph.D. in Materials Science

Tools

Modeling & simulation

Characterization equipment

Metrology tools

Job description

Tokyo Electron Limited is seeking a Senior Heterogeneous Integration Process Engineer for its Albany, NY location. You will lead R&D programs in 3DI technologies, including C2W, D2W, and wafer bonding, and collaborate with global teams to translate fundamental research into scalable process and equipment solutions.

The role requires a Ph.D. and 5+ years of semiconductor R&D, with strong expertise in advanced packaging and 3D integration, plus hands-on bonding experience and excellent