Senior 3DHI Packaging Modeling Engineer

Global Foundries; Town of Malta (NY); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries seeks an experienced mechanical, thermal or electrical modeler/engineer to address 3DHI and advanced packaging questions across logic, RF, analog and memory technologies. Use commercial modeling tools to guide device, integration and 3DHI optimizations for mechanical, thermal or electrical performance.

Based in our 300mm Malta, New York facility, work with cross‑functional teams to drive simulations, anticipate integration issues and influence technology decisions while upholding

Qualifications

• MS with 5+ years of relevant experience.
• PhD with 3+ years of relevant experience.
• English language fluency (written & verbal).
• Solid understanding of semiconductor processes and integration techniques.
• Good computer/software skills.
• Clear ability to present results to groups.

Responsibilities

• Familiarity with commercial software for mechanical, thermal or electrical modeling.
• Perform stress simulations and assess impact on device performance.
• Anticipate integration/process issues and drive simulations to highlight critical interactions.
• Facilitate discussions to identify simulations that guide 3DHI technology decisions.
• Apply commercial simulation software to mimic semiconductor process flows.
• Collaborate with integration, device, and design engineers to ensure viable tech.

Skills

Mechanical modeling

Thermal modeling

Electrical modeling

English fluency

Strong presentation

Education

M.S. degree in relevant field

Ph.D. in relevant field

Tools

Ansys Mechanical Workbench

Cadence

Mentors Graphics

Keysight ADS

Job description

GlobalFoundries seeks an experienced mechanical, thermal or electrical modeler/engineer to address 3DHI and advanced packaging questions across logic, RF, analog and memory technologies. Use commercial modeling tools to guide device, integration and 3DHI optimizations for mechanical, thermal or electrical performance.

Based in our 300mm Malta, New York facility, work with cross‑functional teams to drive simulations, anticipate integration issues and influence technology decisions while upholding