Lead 3D HI Engineer for Advanced Packaging

Socket.dev; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) and lead 3D-Heterogeneous Integration initiatives across multiple domains.

The role focuses on developing 3D-HI process blocks, bonding, TSV and wafer-to-wafer integration, and end-to-end process collaboration with unit process engineers, vendors, and OSAT partners. Strong problem solving and DOE experience are required.

Qualifications

• Master’s degree in Electrical/Mechanical/Chemical Engineering, Materials Science or related field from an accredited program.
• MS degree with 4–5 years of related work experience.
• Deep knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development.
• Strong problem solving and technical troubleshooting with DOE expertise.
• Minimum overall 3.0 GPA and good academic standing.
• Fluency in English (written and verbal).

Responsibilities

• Drive 3D-HI process development for multi-die stacking and fine pitch bonding.
• Partner with unit process engineers, manufacturing engineers, and vendors.
• Collaborate on joint development projects for 2.5D/3D HI processes.
• Lead end-to-end process integration and planning for prototyping across programs.
• Develop expertise in processes, materials, and tooling; optimize characterization resources.
• Lead data analysis, interpret results, and understand failure modes.
• Identify and resolve process integration issues; generate IP for wafer integration and packaging tech.

Skills

Problem solving

Design of experiments

Data analysis

English fluency

Education

Master's degree in Electrical Engineering or related field

PhD preferred

Tools

Process characterization tools

Testing and probing equipment

Job description

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) and lead 3D-Heterogeneous Integration initiatives across multiple domains.

The role focuses on developing 3D-HI process blocks, bonding, TSV and wafer-to-wafer integration, and end-to-end process collaboration with unit process engineers, vendors, and OSAT partners. Strong problem solving and DOE experience are required.