Senior IC Packaging & SI Engineer — RF/mmWave

Blue Origin; San Francisco (CA); On-site; USD 230,398 - 322,557; Full time

Benefits offered by this job

Relocation provided

Travel up to 10%

Technical assessment during interviews

Job summary

Blue Origin seeks a Senior IC Packaging: Signal and Power Integrity Engineer to own SI and PI for RFIC and mmWave packaging. You will perform HFSS simulations, analyze power delivery, and collaborate with RFIC, mmWave, ASIC, and SoC teams to meet packaging requirements.

The role may involve relocation and travel up to 10% and is onsite in multiple U.S. sites with a strong focus on safety and innovation.

Qualifications

• Bachelor's degree in Electrical Engineering or related field such as Computer Engineering.
• 7+ years of industry experience or equivalent research.
• Experience delivering IC packaging in production or tangible deliveries.
• Expertise with 2.5D and 3D electromagnetic simulators such as HFSS, EMX, or Momentum.
• Experience with RF modeling, RF impedance and signal/power integrity for high-speed routing.
• U.S. citizen or permanent resident or eligible for work in the U.S.

Responsibilities

• Own signal and power integrity for RF/Mixed-Signal and mmWave IC packaging designs.
• Perform SI analysis and HFSS simulations for high-speed signals across package interfaces.
• Design and analyze power delivery networks using HFSS to meet PI targets.
• Model and characterize RF and mmWave packaging with HFSS tools and procedures.
• Collaborate with RFIC, mmWave, ASIC, Package Layout, and SoC teams on package requirements.
• Lead the SI/Pi portion of package delivery as a technical lead.
• Create documentation and support design reviews for packaging deliverables.

Education

Bachelor's degree in Electrical Engineering or related field such as Computer Engineering

Advanced degree (Master's or PhD) in Electrical Engineering or related field

RF modeling, RF impedance, and signal and power integrity for high-speed routing

Tools

HFSS

EMX

Momentum

Cadence Allegro

Job description

Blue Origin seeks a Senior IC Packaging: Signal and Power Integrity Engineer to own SI and PI for RFIC and mmWave packaging. You will perform HFSS simulations, analyze power delivery, and collaborate with RFIC, mmWave, ASIC, and SoC teams to meet packaging requirements.

The role may involve relocation and travel up to 10% and is onsite in multiple U.S. sites with a strong focus on safety and innovation.