IC Packaging Design Engineer, Amazon Leo

Amazon Kuiper Manufacturing Enterprises LLC; San Diego (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Amazon Kuiper Manufacturing Enterprises LLC is seeking an IC Packaging Design Engineer to design RF packaging for mm‑wave beamforming ICs and front‑end modules, with a focus on power optimization.

You will collaborate with RF, antenna, and EE teams to define layouts, run 3D EM simulations (HFSS, Momentum), and guide package qualification and production readiness.

Qualifications

• Bachelor's degree in Electrical Engineering or related field required.
• 5+ years of RF design experience, preferably in advanced node packaging.
• Track record of designs moving to volume production and RF systems experience.

Responsibilities

• Collaborate with digital and RF chip designers to define floorplans and ball maps for beamforming ICs.
• Work with vendors on stack-ups, materials, and thermal testing/design.
• Analyze cost/performance trade-offs and complete layout of package types (FCBGA, FCCSP, WLCSP, QFN).
• Run 3D EM simulations of package+PCB to verify designs (HFSS, Momentum).
• Perform signal integrity checks and model packages for crosstalk and coupling.
• Assist thermal team with simulations of packages and PCBs.
• Collaborate with Antenna and EE teams to design test and application PCBs.
• Advise on qualification of packages (HAST, HTOL, reliability).
• Define AI-driven workflows to accelerate packaging design iterations.

Skills

RF design

Packaging design

3D EM simulations

HFSS

Momentum

Impedance matching

Power integrity

SERDES

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical or Communications Engineering

Tools

HFSS

Momentum

Job description

Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.

Come work at Amazon!

The Role

As an IC Packaging Design Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third-party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.

As a member of the packaging team, you will be responsible for package design for mm-wave beamforming SoCs and front-end modules. Strong focus will be on creating the most power optimized solution for a given system performance.

Export Control Requirement

Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Key job responsibilities

• Collaborate with digital design, and RF chip designers define floorplans, bump maps, and ball maps for beamforming ICs.
• Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
• Analyze cost/performance trade-offs, and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN, etc.
• Setup and run 3D electromagnetic simulations of package + PCB in tools such as HFSS and Momentum to verify your designs.
• Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
• Assist the thermal team in defining and running thermal simulations of packages and PCBs.
• Collaborate with the Antenna and EE teams to design and layout test and application PCBs for your packages.
• Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
• Define and implement AI-driven workflows for packaging design, leveraging automation and machine learning to accelerate design iterations and optimize performance.

Basic Qualifications:

• Bachelor's degree in Electrical Engineering or a related field
• 5+ years of experience in RF design, preferably in an advanced node
• Proven track record where products have gone to volume production
• Experience with RF communication systems

Preferred Qualifications:

• Master's degree in Electrical or Communications Engineering or a related field
• 7+ years of experience designing full-custom packages/PCBs for high performance chips.
• Strong understanding of RF fundamentals such as s-parameters, impedance matching, and passive components such as couplers and transmission lines.
• Strong understanding of power integrity fundamentals, including selection and optimization of passives in package.
• Experience routing high-speed, high pin count digital and analog interfaces (e.g. SERDES, CPU, memory).
• Understanding of package materials properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Los Angeles County applicants:

Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company's reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you're applying in isn't listed, please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign‑on payments and restricted stock units (RSUs). Final compensatio